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Top stocks to buy: Stock recommendations for the week starting June 16, 2025
Top stocks to buy: Stock recommendations for the week starting June 16, 2025

Time of India

time6 days ago

  • Business
  • Time of India

Top stocks to buy: Stock recommendations for the week starting June 16, 2025

Top stocks to buy (AI image) Stock market recommendations: According to Motilal Oswal Financial Services Ltd, the top stock picks for the week (starting June 16, 2025) are Home First Finance and Kaynes. Let's take a look: Stock Name CMP (Rs) Target (Rs) Upside (%) Home First Finance 1268 1500 18% KAYNES 5478 7300 33% Home First Finance HomeFirst, with 155 branches across 13 states, is sharpening its focus on emerging states with strong infra growth. Technology remains its key differentiator, with 50%+ of sourcing now fully digital and ~75% Account Aggregator penetration as of FY25. Having recently received a credit rating upgrade from both ICRA and India Ratings, coupled with the 50bps repo rate cut by the RBI, HomeFirst is expected to lower its cost of borrowing while supporting NIM expansion. Its strong fundamentals, healthy return ratios, and superior execution reinforce its position as a top Affordable Housing Fin. franchise. We estimate a 30% PAT CAGR over FY25-27E, driven by a proven model and a seasoned, transparent leadership. Kaynes Kaynes Technologies is expanding across EMS, HDI PCB manufacturing, and OSAT, targeting high-tech, high-margin segments. It aims to achieve USD 1 billion revenue by FY28, supported by strong orders in automotive, aerospace, industrial, and medical sectors, along with strategic North American acquisitions. by Taboola by Taboola Sponsored Links Sponsored Links Promoted Links Promoted Links You May Like Giao dịch CFD với công nghệ và tốc độ tốt hơn IC Markets Đăng ký Undo HDI PCB and OSAT units are expected to commercialize by 4QFY26, targeting INR25b revenue in FY27 and INR50b by FY28, with robust margins (~30%/20%). FY25 revenue rose 51% YoY to INR27b, slightly below guidance due to railway order delays. We estimate revenue/EBITDA/PAT CAGR of 57%/61%/70% over FY25–27, driven by scale and margin gains. Stay informed with the latest business news, updates on bank holidays and public holidays . AI Masterclass for Students. Upskill Young Ones Today!– Join Now

Muted outlook for Malaysia's semiconductor sector amid low factory utilisation
Muted outlook for Malaysia's semiconductor sector amid low factory utilisation

New Straits Times

time6 days ago

  • Business
  • New Straits Times

Muted outlook for Malaysia's semiconductor sector amid low factory utilisation

KUALA LUMPUR: The near-term outlook for Malaysia's semiconductor sector remains lacklustre, weighed down by weak end-market demand and poor factory utilisation rates, according to MIDF Research. Following the recently concluded first quarter earnings season, the firm said most outsourced semiconductor assembly and test (OSAT) companies under its coverage delivered disappointing financial performances. Maintaining its "neutral' stance on the technology sector, MIDF Research said the unfavourable utilisation rate led to the OSAT companies under its coverage posting appalling earnings performance. This, it said, has resulted in two downgrades in stock recommendations, namely D&O Green Technologies Bhd and Unisem (M) Bhd to "Trading Sell" and "Sell", respectively. Meanwhile, Inari Amertron Bhd has been upgraded to "Neutra" from "Trading Sell" previously, given the limited downside risk and relatively better earnings resiliency as compared to its peers. MIDF Research expects the earnings for the second quarter to remain relatively stagnant on a sequential basis, given the lack of positive development. "We foresee a more gradual pace of recovery in the second half of this year to make up for the lacklustre first half. "This is in tandem with the World Semiconductor Trade Statistics (WSTS) forecast for 2025, whereby not all segments are expected to show growth," the firm said. The WSTS has maintained its forecast of 11.2 per cent year-on-year (YoY) growth for the global semiconductor market in 2025. For 2024, global semiconductor sales reached US$630 million, slightly above the WSTS forecast by 0.5 per cent. As a result, the 2025 market value is now expected to be US$700.9 million, up by 0.5 per cent. WSTS said growth will mainly be driven by the logic and memory segments, supported by demand for artificial intelligence, cloud infrastructure and advanced consumer electronics. MIDF Research said artificial intelligence (AI) remains the only clear catalyst at this juncture. Meanwhile, the firm continues to see challenges from the smartphone and automotive markets, which is expected to weigh on the performance of the local semiconductor companies. MIDF Research noted that the International Data Corporation (IDC) is now expecting the worldwide smartphone market to grow marginally this year by 0.6 per cent YoY to 1.24 billion units from 2.3 per cent previously in the February 2025 forecast. This is in view of high uncertainty, tariff volatility and microeconomic challenges such as inflation and unemployment across many regions leading to a slowdown in consumer spending. Moreover, IDC is expecting low single-digit growth until 2029 with a five-year compound annual growth rate of 1.4 per cent due to increasing smartphone penetration, lengthening refresh cycles and cannibalisation from used smartphones. The growth for 2025 will be primarily coming from China at 3.0 per cent YoY due to the subsidies. "We do not discount the possibility that the effect of the subsidies could be temporary, as we view that demand to be driven by innovation rather than the subsidies. This is also on top of the economic concerns," MIDF Research said. Meanwhile, Apple is expected to contract by 1.9 per cent YoY in 2025, which the firm said could hinge on the upcoming iPhone 17 launch. "Demand should disappoint if there are only minimal upgrades seen as compared to the iPhone 16 and/or there is a price increase across the various models," it added. Chin said additional cost pressures may also arise from the upcoming revision of electricity tariffs, scheduled for July, which could affect companies' medium- to long-term planning.

Indian firms target overseas assets to fast-track semiconductor ambitions
Indian firms target overseas assets to fast-track semiconductor ambitions

Time of India

time12-06-2025

  • Business
  • Time of India

Indian firms target overseas assets to fast-track semiconductor ambitions

Strategic overseas acquisitions by India's nascent semiconductor companies are set to emerge as a key enabler for the country's ambitions in chip manufacturing and assembly, ensuring access to proprietary expertise, precision equipment, and critical intellectual property, experts told ET. Indian firms including Tata Electronics and L&T Semiconductor Technologies (LTSCT) have recently made significant moves to acquire foreign assets even as they invest in greenfield facilities within the country. These acquisitions bring experienced engineering teams and operational know-how, which are essential for upskilling local workforces and establishing robust training pipelines, explained Kunal Chaudhary, partner and co-leader, inbound investment group, at EY India. LTSCT and Kaynes Semicon are jointly acquiring the power modules business of Fujitsu General Electronics, based in Japan, while opto-semiconductor maker Polymatech last year acquired US-based semiconductor equipment provider Nisene Technology Group to build an integrated chip manufacturing business. Tata Electronics is exploring takeovers of semiconductor fabrication and outsourced semiconductor assembly and test (OSAT) facilities in Malaysia. Chaudhary said while India has already built a strong presence in chip design, moving into OSAT — a high-margin segment that includes advanced packaging and assembly — will be key to climbing the value chain. Discover the stories of your interest Blockchain 5 Stories Cyber-safety 7 Stories Fintech 9 Stories E-comm 9 Stories ML 8 Stories Edtech 6 Stories With advanced packaging technologies becoming critical to semiconductor innovation, India's entry into this space could enhance its global positioning, he said. After Kaynes and LTSCT announced acquisition of Fujitsu General's power modules business for Rs 118.34 crore on Monday, Kaynes CEO Raghu Panicker said the deal opens up new avenues for advanced semiconductor packaging excellence. 'This move strengthens Kaynes' OSAT capabilities, while aligning with our long-term strategy of supporting global original equipment manufacturers through best-in-class technology and scalable infrastructure,' he told ET. Kaynes is one of the four companies under the India Semiconductor Mission 1.0 building OSATs in the country, while Larsen & Toubro has invested more than $300 million to create its fabless chip company LTSCT. ET on June 3 reported that Tata Electronics is in talks with several global semiconductor companies to acquire a fabrication or OSAT plant in Malaysia. The move is aimed at bolstering the Tata Group company's knowledge and talent base ahead of its ambitious foray into semiconductor fab, assembly and packaging in India. 'Most acquisitions and partnerships at the moment are really about two things: gaining access to trained talent – essentially acqui-hires – and jump-starting work on cutting-edge technologies,' said Prithvideep Singh, general manager at Mohali-based Continental Device India Ltd (CDIL) that has a partnership with German semiconductor manufacturer Infineon Technologies. 'Gaining access to know-how is only half the battle,' he said. 'Transferring it to Indian operations and building capability within local teams…demand years of groundwork, deep technical maturity, and process discipline.' Infineon supplies high performance silicon wafers, and CDIL packages and distributes advanced power semiconductors like MOSFETs and modules specifically tailored for the Indian market, including for electric vehicles and renewables. 'All the JVs and strategic partnerships are a result of the need for Indian entities to build their core competency with best in class proven technology and manufacturing processes,' said Neil Shah, cofounder and vice-president, research, at Counterpoint Research. He noted that matured nodes foundry and back-end packaging OSAT/ATMP are low hanging opportunities for new entrants. 'Building fabs for advanced nodes is still a distant dream for Indian enterprises as there are just three big players like TSMC, the leader, and Samsung and Intel, which are still struggling versus TSMC,' Shah said. 'So, high value fab will take time if at all one of them decides to set up in India in future, if the other ecosystems develop handsomely,' he explained. Biswajeet Mahapatra, principal analyst at Forrester, said acquiring assets of foreign entities allows Indian companies to access advanced technologies like wafer-level packaging, 2.5D/3D integration, and chiplet-based designs, which are critical for modern semiconductors. By leveraging foreign expertise and infrastructure, Indian companies can reduce reliance on imports for high-end packaging solutions and meet the growing demand from global OEMs like Apple and Intel, he explained. For the broader ecosystem, overseas acquisitions and partnerships can help bridge critical capability gaps. Given the current talent crunch in India, they offer a smart and often necessary path for companies entering the sector, experts said. But the real challenge lies in how effectively that know-how is embedded into Indian operations and scaled with consistency and quality, they added.

Want Karnataka to make for the world, says Patil
Want Karnataka to make for the world, says Patil

New Indian Express

time11-06-2025

  • Business
  • New Indian Express

Want Karnataka to make for the world, says Patil

BENGALURU: Karnataka Minister for Large and Medium Industries and Infrastructure Development MB Patil has said that the State Government wants the state to be a global manufacturing hub like Vietnam and China. 'We have come up with industrial policies and measures towards achieving that goal, where from Karnataka we manufacture for the world,' Patil said at the first edition of Uthpadana Manthana, a post-Invest Karnataka 2025 initiative designed to fast-track the state's vision of becoming India's premier manufacturing hub. 'Uthpadana Manthana reflects our commitment to transform Karnataka into a global manufacturing powerhouse. This initiative goes beyond policy discussions. It is about working directly with industry leaders to co-create practical, high-impact solutions,' Patil said. The day-long conclave brought together around 80 senior executives—CEOs and CXOs—from nearly 60 companies across key sectors, served as a platform to engage directly with industry leaders and co-create an actionable roadmap for industrial growth. These leaders engaged in focused discussions around six priority areas identified by the government. 'Your (participants) insights on improving infrastructure, streamlining clearances, and building talent pipelines will shape our immediate action plan. The broader objective of Uthpadana Manthana is aligned with the state's vision to attract Rs 7.5 lakh crore in investments and create 20 lakh jobs in next five years,' Patil said. The government is also focused on scaling up merchandise exports by leveraging Free Trade Warehousing Zones, export-oriented industrial parks, and faster port access. Karnataka seeks to establish itself as India's most competitive ESDM (Electronic System Design and Manufacturing) destination by attracting OSAT (Outsourced Semiconductor Assembly and Test)/ATMP (Assembly, Test, Mark and Pack) players and strengthening the component ecosystem. With focused efforts in sectors like EVs, semiconductors, aerospace, and advanced textiles, this is just the beginning — Uthpadana Manthana will be a continuous engagement to drive real, lasting impact, he said.

Tata Electronics sends hundreds of staff to Taiwan for semicon training
Tata Electronics sends hundreds of staff to Taiwan for semicon training

Time of India

time11-06-2025

  • Business
  • Time of India

Tata Electronics sends hundreds of staff to Taiwan for semicon training

Tata Electronics is sending scores of employees for training to Taiwan as the company's plans for semiconductor fabrication (fab) and assembly and test (OSAT) facility pick up speed, people aware of the developments told ET. So far, the electronics arm of the Tata Group has sent 'a couple of hundred' employees to its technology partner Powerchip Semiconductor Manufacturing Corporation (PSMC) for training in specialised skills required to operate the upcoming fab in Dholera , they said. 'The number of people going in for training to Taiwan from Tata Electronics has certainly gone up as the company gets closer and is preparing for its fab,' one of the persons cited above said. 'Talent is the biggest gap.' Tata Electronics is following a structured plan as the number of people that PSMC can train at one time is limited, the person said. 'About 50 to 75 people are being sent at one go. It's a very methodical, thoughtful process.'Tata Electronics' upcoming Rs 91,000-crore fab in Dholera is expected to generate over 20,000 direct and indirect skilled jobs while the Rs 27,000-crore OSAT facility in Assam would create about 27,000 direct and indirect jobs. While speaking at the ground-breaking ceremony of the Tata unit at Dholera in March 2024, Union Minister for electronics and information technology Ashwani Vaishnaw predicted that the first chip from Dholera unit will be out by December 2026. The Assam OSAT's first phase is expected to become operational by mid-2025. The person quoted earlier said the company is hiring people in batches of around 75 people, based on different functions. "Different batches focus on distinct operations like equipment, yield engineering, process technology and another on quality engineering – which is generally a smaller group that doesn't need as many people,' the person said. It has hired both fresh college graduates and those with a few years of experience in the industry, and 'is sending these people to Taiwan for training." Tata Electronics has been doubling down on the talent front, be it hiring top executives from chip makers like Intel and GlobalFoundries, or making its fresh or less experienced employees ready and equipped with the requisite skills. It has hired both fresh college graduates and those with a few years of experience in the industry and 'is sending these people to Taiwan for training,' the person cited above said. ET had reported on May 26 that the company has appointed Tim McIntosh as vice president and head of operations and manufacturing excellence of Tata Semiconductor Assembly and Test (TSAT). McIntosh is the latest senior executive to be hired from Intel, having worked at the US firm for 34 years. In his last role at Intel, he was the advanced packaging factory general manager. Tata Electronics chief executive and managing director Randhir Thakur , too, joined from Intel, where he served as the president of Intel Foundry Services. In April, the company appointed GlobalFoundries' Asia president KC Ang as the president and head of Tata Semiconductor Manufacturing. ET had also reported on June 3 that the company may possibly acquire a Malaysian chip plant as a means to gain on-ground experience of how to run such facilities. As per the firm's agreement with PSMC, the technology partner will provide design and construction support to build India's first AI-enabled state-of-the-art greenfield fab in Gujarat, license a broad portfolio of technologies, and provide engineering support to successfully transfer licensed technologies to the fab. This fab will have manufacturing capacity of up to 50,000 wafers per month and will include next-generation factory automation capabilities deploying data analytics and machine learning to achieve industry-best factory efficiency. Tata Electronics said the fab will manufacture chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as AI, automotive, computing and data storage, and wireless communication.

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