Memory and Storage Technology Research Report 2025: High Bandwidth Memory Set to Dominate DRAM Market by 2030 Amid AI Boom and 3D NAND Advancements - Long-term Forecast to 2036
Expansion is fueled by soaring demand for AI, high-performance computing, and advanced data infrastructure. Rebounding from the downturn in 2022-2023, the sector marked unprecedented revenues in 2025 due to AI-driven dynamics. High Bandwidth Memory (HBM) leads the market transformation, with 50% market share in DRAM expected by decade's end. Key players like Samsung and Micron are ramping up HBM3E and HBM4 production. NAND flash innovations continue, with YMTC's 294-layer production and CXMT's DDR5 modules highlighting China's growing influence. Data centers, edge computing, and automotive applications propel demand, leveraging sophisticated storage solutions. The market faces scale challenges but sees potential in 3D DRAM and advanced packaging technologies.
Dublin, June 17, 2025 (GLOBE NEWSWIRE) -- The "The Global Memory and Storage Technology Market 2026-2036" report has been added to ResearchAndMarkets.com's offering.The Global Memory and Storage Technology Market 2026-2036 provides insights into the rapidly evolving memory and storage landscape, delivering critical analysis for technology leaders, investors, and strategic decision-makers navigating the industry's transformation through 2036.
The global memory and storage technology market is poised for significant expansion, projected to exceed $400 billion by 2036, driven by explosive demand from artificial intelligence, high-performance computing, and next-generation data infrastructure. After recovering from the severe cyclical downturn of 2022-2023, the industry achieved record revenues surpassing $200 billion in 2025, marking the beginning of a sustained growth trajectory fundamentally reshaped by AI workloads.
High Bandwidth Memory (HBM) emerges as the market's most dynamic segment. HBM's share of the total DRAM market is expected to reach 50% by decade's end, as AI training and inference applications demand unprecedented memory bandwidth. Leading manufacturers including Samsung, SK hynix, and Micron are aggressively scaling HBM3E production, with next-generation HBM4 technology promising even greater performance gains. NAND flash technology continues evolving through 3D scaling innovations, with manufacturers pushing beyond 300 layers using advanced CMOS Bonded Array (CBA) architectures.
YMTC's Xtacking 4.0 technology and the industry's transition to Penta-Level Cell (PLC) storage demonstrate the sector's relentless density improvements. Meanwhile, emerging memory technologies-including Magnetoresistive RAM (MRAM), Resistive RAM (ReRAM), and Ferroelectric RAM (FeRAM) - are gaining commercial traction, particularly in embedded applications and edge computing devices.
Chinese memory manufacturers are fundamentally altering competitive dynamics, with YMTC achieving 294-layer 3D NAND production and CXMT successfully launching domestic DDR5 modules. China's memory market share continues expanding across consumer and enterprise segments, forcing global leaders to accelerate premium product development and advanced technology adoption. Despite ongoing U.S. export restrictions, Chinese companies demonstrate remarkable technological progress, with JHICC ramping capacity and new entrants like SwaySure Technology strengthening domestic supply chains.
Data centers and cloud infrastructure represent the largest growth driver, consuming increasingly sophisticated storage solutions optimized for AI/ML workloads. The economic advantages of QLC SSDs over traditional HDDs in hyperscale environments are reshaping storage hierarchies, with 10PB QLC deployments delivering $30 million cost savings over traditional tiered storage architectures. Edge computing and automotive applications create additional demand vectors, as autonomous vehicles and IoT devices require high-performance, reliable memory solutions.
The industry faces mounting scaling challenges as conventional planar technologies approach physical limits. 3D DRAM architectures, vertical transistor designs, and novel cell structures represent critical technological pathways beyond 2030. Advanced packaging innovations, including wafer-to-wafer bonding and chiplet integration, enable continued performance improvements while managing manufacturing complexity.
Environmental sustainability increasingly influences technology development, with manufacturers investing in energy-efficient designs and circular economy initiatives. Geopolitical tensions continue reshaping global supply chains, driving regionalization trends and technology transfer restrictions that impact long-term market dynamics. The memory and storage technology market to 2036 represents a fundamental transformation driven by AI proliferation, technological breakthrough achievements, and evolving competitive landscapes. Success requires navigating complex scaling challenges while capitalizing on explosive demand from next-generation computing applications across all market segments.
Report Highlights
Market Forecasting and Technology Segmentation:
Global market revenue projections spanning 2026-2036 with detailed breakdowns by technology, application, and geographic region
DRAM market analysis including High Bandwidth Memory (HBM) growth trajectories, DDR evolution, and mobile memory trends
NAND flash and SSD market forecasts covering enterprise, consumer, and emerging cell technologies including QLC and PLC developments
Hard disk drive market evolution with energy-assisted recording technologies (HAMR/MAMR) adoption timelines
Emerging memory technologies market sizing for MRAM, ReRAM, FeRAM, and PCM across embedded and standalone applications
Advanced Technology Analysis and Roadmaps:
Detailed DRAM technology progression from planar scaling challenges to 3D architecture development
CMOS bonding and advanced integration technologies including vertical transistor implementations
HBM technology evolution covering 3D stacking, thermal management, and processor integration strategies
NAND flash scaling analysis beyond 300 layers with CBA and Xtacking technology implementations
Comprehensive emerging memory technology comparison including performance benchmarking and commercialization timelines
Supply Chain and Manufacturing Intelligence:
Global manufacturing capacity analysis by technology and region with capital expenditure trends
Technology node migration strategies and yield learning curve optimization
Equipment supplier analysis covering critical manufacturing tools and materials
Regional market dynamics including China's memory industry development and trade restriction impacts
Application-Specific Market Analysis:
AI and machine learning memory requirements including LLM infrastructure scaling
Data center and cloud storage evolution with QLC SSD economic analysis
Automotive memory systems covering ADAS levels and autonomous vehicle storage architectures
Edge computing and IoT memory solutions across industrial and consumer applications
Embedded memory analysis for microcontrollers, SoCs, and advanced semiconductor applications
Strategic Business Intelligence:
Advanced packaging and integration technologies including 3D stacking and chiplet architectures
Processing-in-memory and computational storage development with commercial product analysis
Sustainability and environmental impact assessment across technology lifecycles
Comprehensive pricing analysis with historical trends and future projection models
Technology roadmaps extending to 2036 with breakthrough technology research including quantum and neuromorphic memory
Company Intelligence and Market Positioning:
Detailed profiles of 154 companies across the memory and storage ecosystem
Key Topics Covered:
1 EXECUTIVE SUMMARY1.1 Report Overview and Key Findings1.2 Market Size and Growth Projections 2026-20361.3 Technology Roadmap and Innovation Trends1.4 Market Dynamics and Trade Implications1.5 Investment and Market Outlook
2 INTRODUCTION2.1 Global Memory and Storage Technology Landscape2.2 Computing Architecture Evolution2.3 End-Market Analysis
3 MARKET FORECASTS (2026-2036)3.1 Market Projections3.2 DRAM Market Forecast3.3 NAND Flash and SSD Market Forecast3.4 Hard Disk Drive (HDD) Market Forecast3.5 Cloud and Data Center Storage Forecast3.6 Edge Computing Storage Forecast3.7 AI and HPC Memory/Storage Forecast3.8 Emerging Memory Technologies Forecast
4 DRAM TECHNOLOGY ANALYSIS AND ROADMAPS4.1 Conventional DRAM Scaling and Challenges4.2 3D DRAM Architecture Development4.3 CMOS Bonding and Advanced Integration4.4 High Bandwidth Memory (HBM) Technology
5 NAND FLASH TECHNOLOGY ANALYSIS AND ROADMAPS5.1 3D NAND Scaling and Layer Count Evolution5.2 CMOS Bonded Array (CBA) and Xtacking Technologies5.3 Multi-Level Cell Technology Evolution5.4 NAND Interface and Form Factor Evolution5.5 Advanced NAND Technologies
6 EMERGING MEMORY TECHNOLOGIES6.1 Magnetoresistive RAM (MRAM) Technology6.2 MRAM Applications and Market Development6.3 Resistive RAM (ReRAM/RRAM) Technology6.4 ReRAM Development and Applications6.5 Ferroelectric RAM (FeRAM) Technology6.6 Phase Change Memory (PCM) Technology6.7 Next-Generation Memory Architectures6.8 Emerging Memory Technology Comparison
7 SUPPLY CHAIN AND MANUFACTURING ANALYSIS7.1 Global Supply Chain Mapping7.2 Manufacturing Capacity and Investment7.3 Technology Node Migration and Yield
8 REGIONAL MARKET ANALYSIS8.1 China Memory Industry Development8.2 Trade Restrictions and Geopolitical Impact8.3 Regional Market Dynamics
9 APPLICATIONS9.1 AI and Machine Learning Memory Solutions9.2 Data Center and Cloud Storage Evolution9.3 Automotive Memory and Storage Systems9.4 Edge Computing and IoT Memory9.5 Embedded Memory for Advanced Applications
10 ADVANCED PACKAGING AND INTEGRATION TECHNOLOGIES10.1 3D Integration and Packaging Innovation10.2 Hybrid Bonding and Advanced Assembly10.3 Processing-in-Memory and Near-Memory Computing
11 SUSTAINABILITY AND ENVIRONMENTAL IMPACT11.1 Memory Technology Environmental Footprint11.2 Circular Economy and End-of-Life Management
12 PRICING ANALYSIS AND ECONOMIC MODELS12.1 Historical and Current Pricing Trends12.2 Cost Structure and Economics12.3 Future Pricing Projections and Models
13 TECHNOLOGY ROADMAPS AND FUTURE DEVELOPMENTS13.1 Long-Term Memory Technology Vision13.2 Breakthrough Technologies and Research13.3 System-Level Integration Evolution
14 COMPANY PROFILES (154 Company Profiles)
3D Plus
4DS Memory
Adata Technology
Advantest Corporation
Alliance Memory
AMD
Amkor Technology
Analog Devices
AP Memory
Applied Materials
ASE Group
ASM International
ASML Holding
Avalanche Technology
BeSang Inc.
Besi
Camtek Ltd.
Canon Inc.
CXMT
Cisco Systems
Crossbar Inc.
Dell Technologies
Dosilicon
Etron Technology
ESMT
Everspin Technologies
EVG
Ferroelectric Memory Company
Fidelix
Fudan Microelectronics
Fujitsu Limited
Giantec Semiconductor
GigaDevice Semiconductor
GlobalFoundries
Google LLC
GSI Technology
Hanmi Semiconductor
Hanwha Precision Machinery
HFC
HHGrace
Hikstor
Hitachi Ltd.
HLMC
Honeywell International
HP Inc.
Huawei Technologies
IBM Corporation
IMEC
Infineon Technologies
Innostar Semiconductor
Innovation Memory
Inston Inc.
Intel Corporation
Intelligent Memory
ISSI
JCET Group
JHICC
Kingston Technology
Kioxia Corporation
KLA Corporation
Kneron Inc.
Lam Research
Lenovo Group
Longsys Electronics
Lite-On Technology
Lyontek Inc.
Macronix International
Marvell Technology
Maxio Technology
Maxim Integrated
MaxLinear Inc.
Materion Corporation
MediaTek Inc.
Merck KGaA
Meta Platforms
Microchip Technology
Micron Technology
MonolithIC 3D
Montage Technology
Nantero Inc.
Nanya Technology
Naura Technology
Nikon Corporation
NEC Corporation
Neo Semiconductor
NetApp Inc.
NetList Inc.
Neumonda
NGD Systems
Nova Measuring
Numem Inc.
Nuvoton Technology
NXP Semiconductors
onsemi
Onto Innovation
Phison Electronics
Powerchip Semiconductor
Powertech Technology
Puya Semiconductor
Qualcomm Inc.
RAAAM Memory Technologies
RAMXEED
Rambus Inc.
Realtek Semiconductor
Renesas Electronics
Rohm Semiconductor
Samsung Electronics
SanDisk Corporation
ScaleFlux
For more information about this report visit https://www.researchandmarkets.com/r/ocuyyt
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