Latest news with #semiconductor
Free Malaysia Today
4 hours ago
- Business
- Free Malaysia Today
Strong investor interest, but Penang land take-up modest, says Chow
Chief minister Chow Kon Yeow launching the Penang Industrial Master Plan 2030. (Bernama pic) GEORGE TOWN : Penang chief minister Chow Kon Yeow said despite the state continuing to attract investors amid a global semiconductor boom, demand for new industrial land remains modest, with just about 100 acres (40ha) taken up each year. The state government, however, has over 2,000 acres (800ha) of industrial land earmarked for development, including sites under acquisition, reclamation or request-for-proposal stages, to ensure long-term availability for future growth. Chow was responding to a question on the availability of industrial land in the state to cater to future investors. 'At 100 acres a year, 2,000 acres will last us for decades. For example, one of our industrial parks, which spans over 1,000 acres, took more than 15 years to complete since it was initiated in 2008,' he told reporters here today. Chow said not all investors want land, adding that Chinese investors, for example, are content with taking up idle factories so they have a quick turnaround. He said these Chinese investors would rather purchase or lease existing factory sites and repurpose them instead of waiting for new land to be made available. 'They want to start quickly, so they look for idle or underutilised factories. Sometimes, these are leased or bought from companies with excess capacity,' he said. He also said there are factories with enough land to expand within their compounds, and they build new facilities there. 'These count as fresh investments, too,' he said. He said Penang recorded RM13 billion in approved investments recently, but this figure covers various areas, including brownfield sites, digital economy initiatives and existing infrastructure. Earlier, Chow launched the Penang Industrial Master Plan 2030, which will help expand and improve industrial land supply, infrastructure, and human capital, with a total of 44 projects estimated to cost RM41.2 billion. The plan covers both physical and non-physical industrial development, including zoning of new greenfield sites, upgrading existing greyfield and bluefield industrial areas, and rehabilitating brownfield sites. Greenfield areas are untouched land meant for brand-new industrial parks, while greyfield zones are older, underused sites that can be upgraded. Bluefield areas combine new development with the revitalisation of existing spaces, and brownfield sites are former industrial areas that may be polluted or abandoned, targeted for clean-up and reuse. Penang currently has 54 industrial parks and more than 8,900 manufacturing-related establishments, the majority located in Seberang Perai. Key industries include machinery and equipment, electrical and electronics, basic and fabricated metal products, and food processing technology. The plan forecasts a total of 5,310ha of industrial land available by 2030, with new zones identified for future development in Batu Kawan, Bertam, and Penang South Island (reclaimed island).
Bloomberg
10 hours ago
- Business
- Bloomberg
Japan Chemicals Firm CEO Fights to Keep Job as Investors Revolt
In a sign of rising shareholders' activism, a president of a semiconductor material maker is at risk of getting voted out of office at the firm's annual general meeting Saturday. Eiji Sato is facing an uphill battle to be re-appointed as president and CEO of Taiyo Holdings Co., a position he has held since 2011, after some shareholders criticized his response to various acquisition proposals as being too slow.
Malay Mail
11 hours ago
- Business
- Malay Mail
Malaysia's trade hits RM252b in May, powered by E&E exports, says Miti
KUALA LUMPUR, June 20 — Malaysia's trade increased by 2.6 per cent in May 2025 to reach RM252.48 billion, marking the 17th consecutive month of year-on-year growth since January 2024, said the Ministry of Investment, Trade and Industry. In a statement today, it said exports recorded a slight decrease of 1.1 per cent to RM126.62 billion, while imports grew 6.6 per cent to RM125.86 billion. Trade surplus for the month stood at RM766.3 million, maintaining a trade surplus for the 61st consecutive month since May 2020. The ministry noted that exports of electrical and electronics (E&E) products continued to show resilient performance, registering an increase of nearly RM4 billion — consistent with the World Semiconductor Trade Statistics forecast of an 11.2 per cent increase in global semiconductor sales in 2025. 'As a key player in the global semiconductor supply chain, Malaysia stands to benefit significantly from this anticipated expansion. 'Nevertheless, potential challenges remain, notably the uncertainties in global economic conditions. While the sector's outlook remains positive, proactive policy responses will be crucial to sustain this growth momentum,' it said. According to Miti, trade, exports and imports achieved their highest cumulative value on record for the January to May 2025 period, with trade growing 6.2 per cent to RM1.23 trillion compared to the corresponding period in 2024. Exports expanded 5.5 per cent to RM638.48 billion and imports rose 6.9 per cent to RM591.54 billion, while the trade surplus slipped 9.4 per cent to RM46.94 billion. The ministry noted that exports to key trading partners, including the United States and the European Union recorded robust growth, while exports to Taiwan not only expanded but also attained a new record high. 'Exports to Free Trade Agreement (FTA) partners, notably the United Kingdom and New Zealand also recorded increases, primarily due to higher shipments of palm oil-based manufactured products,' it added. — Bernama
Associated Press
a day ago
- Business
- Associated Press
Advanced Semiconductor Packaging Market Research Report 2025-2035: Technological Innovations are Reshaping the Semiconductor Landscape Beyond Traditional Moore's Law Scaling
DUBLIN--(BUSINESS WIRE)--Jun 19, 2025-- The 'The Global Advanced Semiconductor Packaging Market 2025-2035" report has been added to offering. The Global Advanced Semiconductor Packaging Market 2025-2035 provides a comprehensive analysis of the rapidly evolving advanced semiconductor packaging industry, examining how technological innovations are reshaping the semiconductor landscape beyond traditional Moore's Law scaling. The report provides essential strategic intelligence for semiconductor manufacturers, packaging providers, equipment suppliers, materials companies, electronics OEMs, and investors to navigate the complex advanced packaging landscape. It identifies key innovation vectors, potential market disruptions, and strategic partnership opportunities that will shape competitive positioning through 2035. With semiconductor packaging increasingly becoming the critical enabler for next-generation electronic systems-from AI accelerators to autonomous vehicles-this report delivers the actionable insights needed to capitalize on the industry's shift from traditional monolithic approaches to heterogeneous integration and advanced packaging solutions. The advanced semiconductor packaging market is experiencing rapid growth, driven by technological demands that are pushing the industry beyond traditional Moore's Law scaling. The market's growth is underpinned by the increasing importance of packaging technologies in addressing computing demands. The telecom and infrastructure sector currently dominates the market, and the mobile and consumer segment is emerging as the fastest-growing market. 3D stack memory technologies-including HBM, 3DS, 3D NAND, and CBA DRAM-are key growth drivers. The fastest-growing platforms include CBA DRAM, 3D SoC, active silicon interposers, 3D NAND stacks, and embedded silicon bridges. These technologies are critical for meeting the increasing performance, power, and miniaturization demands of modern electronics. Heterogeneous integration and chiplet-based designs are revolutionizing semiconductor architecture. Major industry players like TSMC, Intel, AMD, and Nvidia are heavily investing in advanced packaging solutions to overcome the limitations of traditional monolithic chip designs. The adoption of hybrid bonding technologies is particularly transformative, enabling finer interconnect pitches and higher integration densities. The competitive landscape is evolving as foundries, IDMs, and OSATs vie for market share. In 2024, memory players including YMTC, Samsung, SK Hynix, and Micron. Top OSATs like ASE, SPIL, JCET, Amkor, and TF continue to provide assembly and test services while developing their high-end packaging capabilities through UHD FO and mold interposer technologies. Looking toward 2035, several trends will shape the market. The integration of chiplets using 3D SoC, 2.5D interposers, embedded silicon bridges, and co-packaged optics will create increasingly complex '3.5D' packages. Panel-level packaging is gaining traction for larger packages, offering cost advantages over wafer-level processes. Simultaneously, the industry is transitioning from micro-bump technology to bumpless hybrid bonding, enabling finer interconnect pitches necessary for advanced nodes. By application, high-performance computing, AI accelerators, data centers, and autonomous vehicles represent the fastest-growing segments. The rise of AI and cloud computing is driving demand for advanced memory packaging solutions like HBM and specialized processors requiring sophisticated heterogeneous integration. Further consolidation among suppliers is likely, with foundries and IDMs strengthening their packaging capabilities. The emergence of new players from regions like China will intensify competition, while the importance of equipment suppliers like BESI, Applied Materials, and EVG will grow with the adoption of cutting-edge bonding technologies. Report Contents include Company Profiles For more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. View source version on CONTACT: Laura Wood, Senior Press Manager [email protected] E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 KEYWORD: INDUSTRY KEYWORD: TECHNOLOGY PACKAGING SEMICONDUCTOR MANUFACTURING SOURCE: Research and Markets Copyright Business Wire 2025. PUB: 06/19/2025 07:51 AM/DISC: 06/19/2025 07:51 AM
TechCrunch
a day ago
- Business
- TechCrunch
A timeline of the US semiconductor market in 2025
It's already been a tumultuous year for the U.S. semiconductor industry. The semiconductor industry plays a sizable role in the 'AI race' that the U.S. seems determined to win, which is why this context is worth paying attention to: from Intel's appointment of Lip-Bu Tan to CEO — who wasted no time getting to work trying to revitalize the legacy company — to Joe Biden proposing sweeping new AI chip export rules on his way out of office that never came to fruition. Here's a look at what's happened in the first half of 2025. June Intel appoints new leadership June 18 – Intel announced four new leadership appointments that Intel says will help it move toward its goal of becoming an engineering-first company again. Intel announced a new chief revenue officer in addition to multiple high-profile engineering hires. Intel to begin layoffs June 17 – Intel will begin to lay off a significant chunk of its Intel Foundry staff in July. The company plans to eliminate at least 15%, and up to 20%, of workers in that business unit. These layoffs aren't a shock: It was rumored back in April, and Intel's CEO Lip-Bu Tan has said he wants to flatten the organization. Nvidia won't report on China June 13 – Nvidia isn't counting on the U.S. backing off of its AI chip export restrictions anytime soon. After the company took a financial hit from the newly imposed licensing requirements on its H20 AI chips, Nvidia CEO Jensen Huang said the company will no longer include the Chinese market in future revenue and profit forecasts. AMD acquires the team behind Untether AI June 6 – AMD makes another acquisition — this time focused on talent. The company acqui-hired the team behind Untether AI, which develops AI inference chips, as the semiconductor giant continues to round out its AI offerings. Techcrunch event Save $200+ on your TechCrunch All Stage pass Build smarter. Scale faster. Connect deeper. Join visionaries from Precursor Ventures, NEA, Index Ventures, Underscore VC, and beyond for a day packed with strategies, workshops, and meaningful connections. Save $200+ on your TechCrunch All Stage pass Build smarter. Scale faster. Connect deeper. Join visionaries from Precursor Ventures, NEA, Index Ventures, Underscore VC, and beyond for a day packed with strategies, workshops, and meaningful connections. Boston, MA | REGISTER NOW AMD is coming for Nvidia's AI hardware dominance June 4 – AMD continued its shopping spree. The company acquired AI software optimization startup Brium, which helps companies retrofit AI software to work with different AI hardware. With a lot of AI software being designed with Nvidia hardware in mind, this acquisition isn't surprising. May Nvidia lays out the impact of chip export restrictions May 28 – Nvidia reported that U.S. licensing requirements on its H20 AI chips cost the company $4.5 billion in charges during Q1. The company expects these requirements to result in an $8 billion hit to Nvidia's revenue in Q2. AMD acquires Enosemi May 28 – AMD kicks off its acquisition spree. The semiconductor company announced that it acquired Enosemi, a silicon photonics startup. Enosemi's tech, which uses light photons to transmit data, is becoming an increasing area of interest for semiconductor companies. Tensions start to flare between China and the U.S. May 21 – China's Commerce Secretary didn't like the U.S.'s guidance, issued on May 13, that warned U.S. companies that using Huawei's AI chips 'anywhere in the world' was a U.S. chip export violation. The commerce secretary issued a statement that threatened legal action against anyone caught enforcing that export restriction. Intel may be starting to offload its non-core units May 20 – Intel CEO Lip-Bu Tan seemingly got right to work on his plan to spin out Intel's non-core business units. The semiconductor giant is reportedly looking to offload its networking and edge units, which makes chips for telecom equipment, and was responsible for $5.4 billion of the company's 2024 revenue. The Biden administration's AI Diffusion rule is officially dead May 13 – Just days before the Biden administration's Artificial Intelligence Diffusion Rule was set to go into place, the U.S. Department of Commerce formally rescinded it. The DOC said that it plans to issue new guidance in the future, and in the meantime companies should remember that using Huawei's Ascend AI chips anywhere in the world is a violation of U.S. export rules. A last-minute reversal May 7: Just a week before the 'Framework for Artificial Intelligence Diffusion' was set to go into place, the Trump administration plans on taking a different path. According to multiple media outlets, including Axios and Bloomberg, the administration won't enforce the restrictions when they were supposed to start on May 15 and is instead working on its own framework. April Anthropic doubles down on its support of chip export restrictions April 30: Anthropic doubled down on its support for restricting U.S.-made chip exports, including some tweaks to the Framework for Artificial Intelligence Diffusion, like imposing further restrictions on Tier 2 countries and dedicating resources to enforcement. An Nvidia spokesperson shot back, saying, 'American firms should focus on innovation and rise to the challenge, rather than tell tall tales that large, heavy, and sensitive electronics are somehow smuggled in 'baby bumps' or 'alongside live lobsters.'' Planned layoffs at Intel April 22: Ahead of its Q1 earnings call, Intel said it was planning to lay off more than 21,000 employees. The layoffs were meant to streamline management, something CEO Lip-Bu Tan has long said Intel needed to do, and help rebuild the company's engineering focus. The Trump administration further restricts chip exports April 15: Nvidia's H20 AI chip got hit with an export licensing requirement, the company disclosed in an SEC filing. The company added it expects $5.5 billion in charges related to this new requirement in the first quarter of its 2026 fiscal year. The H20 is the most advanced AI chip Nvidia can still export to China in some form or fashion. TSMC and Intel reported similar expenses the same week. Nvidia appears to talk its way out of further chip exports April 9: Nvidia's CEO Jensen Huang was spotted attending dinner at Donald Trump's Mar-a-Lago resort, according to reports. At the time, NPR reported Huang may have been able to spare Nvidia's H20 AI chips from export restrictions upon agreeing to invest in AI data centers in the U.S. An alleged agreement between Intel and TSMC April 3: Intel and TSMC allegedly reached a tentative agreement to launch a joint chipmaking venture. This joint venture would operate Intel's chipmaking facilities, and TSMC would have a 20% stake in the new venture. Both companies declined to comment or confirm. If this deal doesn't come to fruition, this is likely a decent preview of potential deals in this industry to come. Intel spins off noncore assets, announces new initiative April 1: CEO Lip-Bu Tan got to work right away. Just weeks after he joined Intel, the company announced that it was going to spin off noncore assets so it could focus. He also said the company would launch new products, including custom semiconductors for customers. March Intel names a new CEO March 12: Intel announced that industry veteran, and former board member, Lip-Bu Tan would return to the company as CEO on March 18. At the time of his appointment, Tan said Intel would be an 'engineering-focused company' under his leadership. February Intel's Ohio chip plant gets delayed again February 28: Intel was supposed to start operating its first chip fabrication plant in Ohio this year. Instead, the company slowed down construction on the plant for the second time in February. Now the $28 billion semiconductor project won't wrap up construction until 2030 and may not even open until 2031. Senators call for more chip export restrictions February 3: U.S. senators, including Elizabeth Warren (D-Mass) and Josh Hawley (R-Mo), wrote a letter to Commerce Secretary Nominee-Designate Howard Lutnick urging the Trump administration to further restrict AI chip exports. The letter specifically referred to Nvidia's H20 AI chips, which were used in the training of DeepSeek's R1 'reasoning' model. January DeepSeek releases its open 'reasoning' model January 27: Chinese AI startup DeepSeek caused quite the stir in Silicon Valley when it released the open version of its R1 'reasoning' model. While this isn't semiconductor news specifically, the sheer alarm in the AI and semiconductor industries DeepSeek's release caused continues to have ripple effects on the chip industry. Joe Biden's executive order on chip exports January 13: With just a week left in office, former president Joe Biden proposed sweeping new export restrictions on U.S.-made AI chips. This order created a three-tier structure that determined how many U.S. chips can be exported to each country. Under this proposal, Tier 1 countries faced no restrictions; Tier 2 countries had a chip purchase limit for the first time; and Tier 3 countries got additional restrictions. Anthropic's Dario Amodei weighs in on chip export restrictions January 6: Anthropic co-founder and CEO Dario Amodei co-wrote an op-ed in The Wall Street Journal endorsing existing AI chip export controls and pointing to them as a reason why China's AI market was behind the U.S.'. He also called on incoming president Donald Trump to impose further restrictions and to close loopholes that have allowed AI companies in China to still get their hands on these chips.
