Latest news with #chiplet
Yahoo
4 days ago
- Business
- Yahoo
QuickLogic to Exhibit at Chips to Systems Conference (DAC) 2025
SAN JOSE, Calif., June 18, 2025 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs, and endpoint AI solutions, today announced it will exhibit at the 2025 Chips to Systems Conference (DAC) in San Francisco. Visit Booth #2222 to explore QuickLogic's advanced eFPGA Hard IP and chiplet solutions designed to help accelerate SoC and ASIC development and learn how QuickLogic's silicon-proven eFPGA Hard IP enables post-manufacturing flexibility, helping designers reduce time-to-market and cost while meeting performance, power, and area (PPA) goals. You will also discover our chiplet solutions, featuring validated, interoperable blocks backed by Universal PHY™ and a robust ecosystem—making heterogeneous integration faster, easier, and more efficient. Event Details:When: June 23–25, 2025Where: Booth #2222 (Moscone West, 2nd Floor)Website: Come see us at DAC 2025 to learn how QuickLogic's eFPGA IP and chiplet-ready solutions can support your design goals with unmatched flexibility and efficiency. About QuickLogic QuickLogic Corporation is a fabless semiconductor company that specializes in eFPGA Hard IP, discrete FPGAs, and endpoint AI solutions. The company's unique technology, combined with open-source development tools, enables highly customizable and low-power silicon solutions for aerospace and defense, industrial, consumer, and edge computing markets. For more information, visit QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such. View original content to download multimedia: SOURCE QuickLogic Corporation Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
National Post
05-06-2025
- Business
- National Post
Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
Article content First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS ® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Article content LONDON & TORONTO — Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first UCIe™ IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC's Chip-on-Wafer-on-Substrate (CoWoS ®) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. Article content This milestone builds on the recent release of the Alphawave Semi AI Platform, proving readiness to support the future of disaggregated SoCs and scale-up infrastructure for hyperscale AI and HPC workloads. With this tape-out, Alphawave Semi becomes one of the industry's first to enable UCIe connectivity on 2nm nanosheet technology, marking a major step forward for the open chiplet ecosystem. Article content 'We're proud to lead the industry into the N2 era with the first UCIe IP on this advanced node,' said Mohit Gupta, Senior VP & GM, Custom Silicon & IP, Alphawave Semi. 'Our 36G subsystem validates a new class of high-density, power-efficient chiplet connectivity and paves the way for 64G UCIe and beyond—critical for AI and high-radix networking applications.' Article content Alphawave Semi's one of the industry's first UCIe IP subsystem on TSMC's 2nm process delivers 36G performance with 11.8 Tbps/mm bandwidth density, ultra-low power and latency, and advanced features like live per-lane health monitoring and comprehensive testability. Compliant with UCIe 2.0 standard and supporting multi protocols, including PCIe ®, CXL™, AXI, CHI and more with Alphawave Semi's highly configurable and efficient Streaming Protocol D2D Controller. Article content Alphawave Semi is advancing key ecosystem collaborations to enable groundbreaking technologies, leveraging D2D-based open chiplet interoperability to drive a broader AI connectivity platform for the industry. Alphawave Semi's UCIe IP on the TSMC N2 process affirms its position as one of the leading enablers of scalable, open chiplet ecosystems. Article content 'Our latest collaboration with Alphawave Semi underscores our shared commitment to driving advancements in high-performance computing through design solutions that fully leverage the performance and energy-efficiency advantages of TSMC's advanced process and packaging technologies,' said Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC. 'This milestone illustrates how close collaboration with our Open Innovation Platform ® (OIP) partners like Alphawave Semi can enable the quick delivery of advanced interface IP and custom silicon solutions to meet the increasing demands of AI and cloud infrastructure.' Article content Alphawave Semi is already executing on its plans to deliver next-generation UCIe solutions, with 64G UCIe support — empowering AI and HPC customers to lead in a rapidly evolving chiplet-driven landscape. Article content About Alphawave Semi Article content Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in datacenters, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world. To find out more about Alphawave Semi, visit: Article content Article content Article content Article content Article content Contacts Article content Media Contact: Article content Article content Claudia Cano-Manuel Article content Article content Article content
