Latest news with #Xe3
Yahoo
05-06-2025
- Yahoo
Intel Nova Lake CPUs reportedly get a GPU overhaul — Xe3 Celestial and Xe4 Druid IPs used for graphics, media, and display
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel's upcoming Nova Lake chips are expected to advance their modular design philosophy by bringing together future Xe3 and Xe4 IPs to handle different engines on the chip. Jaykihn, an avid Intel leaker, asserts that Nova Lake-S will allegedly use Celestial for its graphics engine. At the same time, Druid will handle media and display functions, likely on a separate SoC Tile. The disaggregated chiplet design, introduced for consumers with Meteor Lake, provides Intel with the flexibility to manufacture less critical chip elements using mature and cheaper fabrication nodes. Meteor Lake splits the media and display capabilities from core graphics. The media and display units were placed on a separate System-on-Chip (SoC) chiplet, manufactured using TSMC's N6 process, while the graphics engine resided on a separate tile produced with TSMC's N5 technology. A similar strategy has been observed in Lunar Lake and Arrow Lake, however, Nova Lake reportedly is poised to advance Intel's chiplet approach by using separate and specialized IPs for these blocks. Jaykihn claims that the integrated graphics (iGPU) on Nova Lake-S (S: Desktop) will be powered by Xe3 (Celestial), meanwhile, the graphics and media engine move to the more advanced Xe4 (Druid). This means that while the integrated GPU will be impressive, the most notable improvements could be in hardware codec support, owing to the shift to a next-generation architecture. Meanwhile, Bionic_Squash reports that the graphics engine will utilize a slightly modified version of Xe3, for better or worse. Should it be an improvement over vanilla Xe3, which we'll see in Panther Lake, it might be comparable to the evolution from Meteor Lake's Xe-LPG to Arrow Lake's Xe-LPG+ (mobile-only), the latter of which introduced XMX engines. Beyond Nova Lake, this is a positive indication for future graphics products from Intel. We could see the first Druid-powered engines by as early as 2026, while Celestial, which is already undergoing pre-validation, is slated to power Panther Lake CPUs next year. It is plausible to say Nova Lake might serve as a test vehicle for Druid, serving as a precursor to a full-fledged product in the future that employs Druid graphics as well. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
15-03-2025
- Business
- Yahoo
Panther Lake launch timeline looks clearer after first public showcase
Intel's Panther Lake chip has now been showcased in public, with the tech brand putting it on display at the Embedded World 2025 conference in Nuremberg, Germany. The Dutch publication, PC Games Hardware shared images of the chip on display, noting that this is the first time the Panther Lake SoC has been seen publicly, not being held up by Intel's former CEO Pat Gelsinger. With the company discussing more of its plans and timelines for the Panther Lake rollout in 2025 and beyond at the conference, more of the component's release strategy has become a lot clearer. Also referred to as the 'Core Ultra 300' mobile platform, Intel is banking on the Panther Lake being a powerful chip as it will be manufactured on the company's custom 18A process. Panther Lake follows the Core Ultra 100 'Meteor Lake' chip, which was released in 2023, and the Core Ultra 200 'Lunar Lake' chip, which is Intel's current flagship. Wccftech noted that Intel's Foundry business is counting on a successful rollout of the Panther Lake to propel its future in the market. The company has already detailed plans to introduce the Panther Lake-H lineup as its premiere offering, then Panther Lake-HX, and others. The coming chip will likely feature the Cougar Cove P-Cores and Skymont E-Cores architectures, as per current reports. Additionally, it is set to include the third-generation Xe3, onboard iGPU, codenamed 'Celestial.' The component follows the second-generation Xe 2 GPU 'Battlemage'. The Xe3 is expected to support at least 16 cores, powering up to 180 TOPS of AI power among its specifications, Wccftech noted. While the Core Ultra 300 is set to be manufactured under the 18A process, PC Games Hardware noted that Intel has split its production between its own Foundry and TSMC, with the latter manufacturer taking charge of the Xe3 graphics portion of the chip. Overall, Intel is still set to announce Panther Lake during the mid-2025 timeframe. This should put hardware partners on schedule to have products ready by January, in time for the coming CES 2026. The industry will surely be excited to see how the SoC will perform alongside similar next-generation chips from competitors.
Yahoo
15-02-2025
- Yahoo
Intel Panther Lake-H CPU hits max turbo power of 64W — mobile chips' leaked specs point to substantial power draw
When you buy through links on our articles, Future and its syndication partners may earn a commission. Hardware leaker Jaykihn has shared what's believed to be the preliminary power specifications for Intel's upcoming Panther Lake-H CPUs, which are set to be used later this year in a new slate of laptops and mobile devices, which were previously shown off at CES 2025. The alleged preliminary spec details three variants of chips within the series, denoting performance, efficiency, and Xe3 cores. These chips are set to be based on Intel's upcoming Celestial architecture. They will likely materialize as Intel's Core Ultra 300H series, and the alleged preliminary power specifications allow some speculation about the kinds of devices the company will target. The first variant shows off a 16-core chip with a 4+8+4 configuration. Assuming this means four performance cores, eight efficiency cores, and four GPU cores. This specific configuration will likely reside in systems alongside a dedicated GPU. PL1 (Performance Base Power - PBP) and PL2 (Maximum Turbo Power - MTP) in both baseline and performance power modes will pull 25W and 64W- respectively. The 4+8+4 configuration has notably fewer efficiency cores than its previous-gen counterparts. The same can be said for the second variant listed, featuring a 24-core configuration split into 4+8+12. This may indicate its suitability for a higher-end device with four performance cores, eight efficiency cores, and 12 GPU cores. The PBP is listed at a baseline of 25W, with an MTP of 55W. In the 'performance' mode, this changes to 25W and 64W, respectively. The cTDP Max headroom on both chip configurations lists higher wattages, up to 80W MTP. This might imply that both chips have some headroom built for burst-heavy tasks like rendering. However, they are also set to be more efficient than the Core Ultra 200H series, which could boost into 100W+ territory. The final listing is for a seemingly lower-end eight-core chip with a configuration of 4+0+4. This will likely be the Core Ultra 300U chip, set to be used in entry-level devices or gaming handhelds. This configuration can run with a PBP of just 15W and an MTP of 44W under the 'baseline' power mode, while it boosts up to a similar 25W PBP and 55W MTP under the 'performance' mode. This tells us that Intel is starting to get serious about efficiency in its mobile chips. While AMD has long held the efficiency crown for x86 mobile devices, this initial power spec may be a step in the right direction for Intel. AMD has gained ground on Intel in both the desktop and laptop CPU market, with competition fiercer than ever. Intel's Panther Lake H CPUs will be produced in volume on the company's 18A (1.8nm-class) process in 2H 2025. The products are expected to be on shelves in early 2026.
