Latest news with #Open-Q
Techday NZ
2 days ago
- Business
- Techday NZ
Lantronix & Aerora partner to advance AI-powered drone systems
Lantronix has entered into a new collaboration with Aerora to drive development in Edge AI-driven solutions for drones, robotics, and surveillance applications targeting multiple industry sectors. The relationship pairs Aerora's OEM platform for AI-powered visual navigation systems with Lantronix's Open-Q System-on-Module (SoM), which leverages Qualcomm Technologies chipsets. This aims to deliver processing power for situational awareness, computational imaging, and real-time decision-making in high-demand scenarios. Market opportunity The global drone market is anticipated to reach $163.6 billion by 2030, with a compound annual growth rate of 15% according to Grandview Research. Segments such as logistics, agriculture, infrastructure and public safety are identified as the principal drivers for this expansion. The U.S. Federal Government has affirmed the importance of unmanned aircraft systems for commercial and government uses, offering support for manufacturers in the field. Lantronix and Aerora are responding to increasing commercial and governmental demand for advanced drone solutions, especially where AI-driven features can offer new capabilities. The partnership is positioned to speed up technological advancement while helping original equipment manufacturers (OEMs) face the challenge of shortening development timelines and maintaining quality. Technology integration At the core of the solution is Aerora's platform, which incorporates pre-integration of key system components including the camera, gimbal, gimbal motors, housing, telemetry and interface. Developers can achieve simultaneous 4K video streaming alongside high-resolution thermal video, which expands operational capacity in surveillance, search and rescue, environmental monitoring, and industrial inspections. The integrated package also includes the Teledyne FLIR Hadron 640R module and Prism software, bringing thermal and RGB imaging to new levels of precision and reliability. Such technologies address the pressure for faster time-to-market and reduced engineering overhead in a competitive sector. "Lantronix's collaboration with Aerora promises to advance the development of AI-powered drones and other intelligent applications, equipping developers with cutting-edge tools from leading embedded compute technologies," said Saleel Awsare, CEO and president of Lantronix. "This breakthrough in advanced AI-driven solutions delivers a transformative impact, opening doors to new opportunities in both private and government sectors." Lantronix's Open-Q SoMs serve as the foundation for the AI systems, providing reliability for drone, robotics and surveillance application developers as they seek to deploy Edge AI while retaining access to embedded compute expertise. OEM focus and compliance Aerora's technology has an emphasis on achieving NDAA (National Defense Authorization Act) compliance, a critical standard for many government and defence customers in the United States. By merging capabilities from Lantronix, Qualcomm Technologies, and Teledyne FLIR, Aerora intends to offer a solution that is not only flexible but scalable for manufacturing at high volumes. "At Aerora, our core mission is to deliver rapid integration, flexible sensor solutions and fully NDAA-compliant manufacturing at scale. By collaborating closely with industry leaders like Lantronix and Qualcomm and integrating advanced imaging technologies such as Teledyne FLIR's Hadron 640R, we empower drone OEMs to significantly reduce development timelines, expand their operational capabilities and confidently meet demanding market requirements," said Ghel Ghedh, chief technology officer for Aerora. This ongoing incorporation of AI-powered navigation, imaging, and control systems is anticipated to support OEM drone manufacturers with faster and more reliable product development, meeting both technology and regulatory benchmarks. Through these efforts, both companies seek to support expansion in drone usage across civil, industrial, and public safety sectors, where high standards for imaging and rapid response are increasingly required.
Bahrain News Gazette
04-03-2025
- Business
- Bahrain News Gazette
Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration
Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc. (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR's thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics. Powered by Lantronix's cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix's seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation. Lantronix at the Forefront of AI Edge Intelligence 'With Lantronix's Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,' said Mathi Gurusamy, Chief Strategy Officer at Lantronix. 'By integrating with Teledyne FLIR's advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,' he added. Advanced AI and Thermal Processing Lantronix's integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include: Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement. Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates. Lantronix's Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include: Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android. Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®. Teledyne FLIR on the Lantronix Collaboration 'Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,' said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. 'Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.' Lantronix Open-Q 5165: Optimized for AI and Edge Computing Lantronix's Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include: Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP 5 th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany. About Lantronix Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix's products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix's advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing. For more information, visit the Lantronix website. Lantronix Media Contact: Gail Kathryn Miller Corporate Marketing & Communications Manager [email protected] Lantronix Analyst and Investor Contact: [email protected] ©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.
