Latest news with #OEMs
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Business Standard
2 hours ago
- Automotive
- Business Standard
TCS expands SDV capabilities with new centres in Germany and Romania
India's largest IT services firm, Tata Consultancy Services (TCS), today announced the expansion of its capabilities in the rapidly evolving Software-Defined Vehicles (SDV) space. TCS has set up two new automotive delivery centres in Germany — located in Munich and Villingen-Schwenningen — as well as an engineering centre in Romania. These new hubs mark a strategic move to help TCS' global automotive clients accelerate their transition to next-generation mobility solutions. The delivery centres in Germany will support automakers in developing and deploying TCS' software-driven services that cater to autonomous driving, infotainment, safety systems and connected vehicle technologies. Meanwhile, the engineering centre in Romania will focus on designing and building advanced automotive software platforms to support early-stage development and innovation. This expansion is part of TCS' long-term strategy to strengthen its end-to-end automotive software capabilities, chip-to-cloud technologies and services. Regu Ayyaswamy, senior vice-president and global head, Internet of Things (IoT) and Digital Engineering at TCS, said: 'These new centres will position TCS at the forefront of automotive innovation, enabling us to deliver state-of-the-art solutions in autonomous driving and advanced cockpit systems. This expansion reaffirms our commitment to leading the transformation in the Software-Defined Vehicles space.' The strategic location of these centres will enable close collaboration with leading European original equipment manufacturers (OEMs) and global automotive enterprises, providing nearshore capabilities. The new centres currently house over 100 professionals who will work alongside more than 2,000 SDV engineers across TCS' global locations. TCS' expansion aligns with the global automotive industry's shift towards software-defined, connected and autonomous mobility. As demand grows for intelligent vehicle technologies, TCS is well-positioned to lead this transformation. Europe is a strategically significant location for TCS' automotive delivery hubs due to its robust automotive industry and the presence of several leading manufacturers in the region. Anupam Singhal, president and business group head, manufacturing, TCS, said: 'The shift to software-defined vehicles marks a defining moment for the automotive industry. With the launch of these new centres, we are deepening our commitment to support OEMs in building the next generation of intelligent, connected and sustainable vehicles. This expansion is a key milestone in our journey toward Future-Ready Mobility — where software, engineering and design, backed by AI, converge to deliver safer, more personalised and continuously enriching experiences for drivers and passengers.' TCS has been serving automotive customers in Europe for the past 25 years and has a strong presence in automotive hubs across the region. The organisation has been delivering innovative solutions in digital cockpit, electrification, autonomous vehicles and connected car ecosystems through digital engineering, IoT, cloud and data analytics. TCS also leverages generative AI to accelerate product development with feature generation and testing in SDVs, enabling faster innovation and enhanced personalisation. TCS' presence in Europe enhances its position in the global automotive value chain by leveraging local talent and expertise, fostering closer collaboration with clients and improving customer satisfaction. TCS has a long-standing commitment to serving as a trusted IT partner for European enterprises, with a presence in the region for over 45 years. TCS Europe has over 15,000 employees.
The Hindu
2 hours ago
- Automotive
- The Hindu
TCS to boost innovation around Software-Defined Vehicle
Tata Consultancy Services has on Friday (June 20, 2025) announced the expansion of its capabilities in the rapidly evolving Software-Defined Vehicles (SDV) space. To drive this, TCS sets up two new Automotive Delivery Centres in Germany: in Munich and in Villingen-Schwenningen, as well as an engineering centre in Romania, said the tech firm. The delivery centres in Germany would support automakers in developing and deploying TCS's software-driven services that cater to autonomous driving, infotainment, safety systems, and connected vehicle technologies. Meanwhile, the engineering centre in Romania would focus on designing and building advanced automotive software platforms to support early-stage development and innovation. This expansion was part of TCS's long-term strategy to strengthen its end-to-end automotive software capabilities, chip-to-cloud technologies, and services, the firm said. Regu Ayyaswamy, Senior Vice President & Global Head, Internet of Things (IoT) and Digital Engineering at TCS, said, 'These new centers will position TCS at the forefront of automotive innovation, enabling us to deliver state-of-the-art solutions in autonomous driving and advanced cockpit systems. This expansion reaffirms our commitment to leading the transformation in the Software-Defined Vehicles space.' Anupam Singhal, President and Business Group Head, Manufacturing, TCS, said, 'The shift to software-defined vehicles marks a defining moment for the automotive industry. With the launch of these new centres, we are deepening our commitment to support OEMs in building the next generation of intelligent, connected, and sustainable vehicles.'' This expansion was a key milestone in TCS' journey toward Future-Ready Mobility — where software, engineering, and design, backed by AI, converge to deliver safer, more personalised, and continuously enriching experiences for drivers and passengers, he added. According to an official communique, TCS has a long-standing commitment to serving European enterprises, including global automotive manufacturers, with a presence in the region for over 45 years. The company has over 15,000 employees in Europe
Yahoo
a day ago
- Automotive
- Yahoo
Global vehicle market slowed in May
For May, the Global Light Vehicle (LV) selling rate is estimated to be 90 million units/year, a slowdown from the improvement seen the previous month. In year-on-year (YoY) terms, the market grew 5% as sales reached 7.6 million units globally. The story remains similar to April in the key markets of China, the US, and Western Europe. China and the US saw positive growth in LV sales while sales in Western Europe continued to decline due to prevailing economic headwinds. Albeit sales in the US are beginning to slow as the industry pulls back on incentives. In other markets, sales in Japan and Korea remain robust, while in Argentina, sales experienced another month of rapid growth, up over 50% YoY. North America US Light Vehicle sales grew by 2.1% YoY in May, to 1.47 million units. There was one extra selling day in May 2025 as compared with May 2024, meaning that sales declined by 1.7% YoY on a selling day-adjusted basis. The annualized selling rate slowed to 15.4 million units/year in May, from 17.4 million units/year in April. The selling rate was hindered by the lack of Memorial Day sales events this year, as OEMs brace for the impact of tariffs. While price rises explicitly linked to tariffs are still rare, the industry is pulling back on incentives, which fell to US$2,609 in May, down by 2.6% YoY. This is leading to higher average transaction prices, which rose to US$46,193 in May, up by 3.1% YoY. Canadian Light Vehicle sales totaled 184k units in May, according to initial estimates. This represents a YoY gain of 4.5%, but the selling rate slowed to 1.62 million units/year in May, from (an adjusted) 1.76 million units/year in April. Although tariffs on vehicles imported from the US are effectively quite rare due to a number of exemptions, consumers may still be pulling back from purchases as the economy slows. In Mexico, sales were estimated at 125k units in May, up by 2.3% YoY. Meanwhile, the selling rate is thought to have decelerated to 1.57 million units/year in May, from 1.61 million units/year in April. The market is still healthy overall, despite economic concerns linked to tariffs. Europe The LV selling rate for Western Europe slipped back slightly to 12.6 million units/year in May, though sales volume was up a modest 1% YoY. The Western European LV market has struggled to meet expectations, with it facing a drag from weak consumer confidence and broader economic uncertainty. In Eastern Europe, the LV selling rate remained broadly flat at 4.3 million units in May. Sales were down nearly 6% YoY. The Russian LV market declined by 29% YoY in May — tight monetary policy and stalled consumer credit growth are restricting auto financing. LV sales in Turkey were up 4% YoY in May as sales reached 103k units. LV demand remains strong as here consumers continue to turn to vehicles as a safeguard against rampant inflation. China In May, Chinese LV sales are estimated to have grown by 10% YoY to around 2.1 mn units, broadly the same volume as April's figure. PV sales totaled 1.9 million units, up 11.5% YoY as the selling rate reached 25.5 million units/year. YTD LV sales now stand at 10 million units, up over 11% from the same period in 2024. The PV sales performance continues to benefit from government subsidies, as the government has extended its vehicle trade-in scrappage incentive scheme through the end of 2025. Tax breaks on NEVs also continue this year.* China's automotive industry continues to see a vehicle price war, though this is causing financial strain, with over a third of manufacturers having liabilities exceeding assets. Major companies like BYD, Geely, and Nio have significant working capital deficits. The government is urging stabilization of supply chains and reduced discounting. Analysts expect industry consolidation by 2026 as weaker firms may fail. Profitability concerns are set to continue for now despite state support, though as state support weakens next year, GlobalData forecasts that so too will the vehicle market. Other Asia In Japan, sales increased YoY by 3.8% in May 2025, down from the prior four months of double-digit growth due to the low-base comparison to the sales a year ago (when vehicle testing irregularities issues hit vehicle production, especially at Daihatsu). The base-year effect momentum is now slowing as vehicle production mostly returned to normal. Meanwhile, OEMs are now clearing backlogged orders by increasing vehicle supply, which will continue supporting domestic vehicle market. Korean LV sales moderated to 1% YoY in May 2025, a shift in momentum from April where sales expanded 7% YoY. The May growth data showed mixed signals, with sales of local models (-2% YoY) showing signs of softness while sales of import cars (+13% YoY) continued to point towards solid growth. The robust sales of import cars in May 2025, partly driven by the low-base effect a year ago, resulted from easing supply chain pressure of major European OEMs, and the soaring delivery of Tesla (+58% YoY). South America Brazilian Light Vehicle sales reached 214k units in May according to preliminary estimates, up by 17.0% YoY. The selling rate increased to 2.55 million units/year in May, from 2.47 million units/year in April. This was the strongest selling rate of the year to date, although it could have been influenced by customers returning after disruptions in the preceding months from Carnival and Easter. Hybrid and electric vehicles accounted for around 10.4% of total sales in May, a record high. Argentina saw another extremely strong month of sales, as the recent tax reduction on many vehicles, along with the liberalization of the country to imported models, continued to boost the market. Sales totaled 52k units in May, up by 58.9% YoY, while the selling rate eased to 597k units/year in May, from an exceptionally high (upwardly adjusted) 675k units/year in April – which had been the strongest rate since August 2018. This article was first published on GlobalData's dedicated research platform, the . "Global vehicle market slowed in May – GlobalData" was originally created and published by Just Auto, a GlobalData owned brand. The information on this site has been included in good faith for general informational purposes only. It is not intended to amount to advice on which you should rely, and we give no representation, warranty or guarantee, whether express or implied as to its accuracy or completeness. You must obtain professional or specialist advice before taking, or refraining from, any action on the basis of the content on our site. 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Associated Press
a day ago
- Business
- Associated Press
Advanced Semiconductor Packaging Market Research Report 2025-2035: Technological Innovations are Reshaping the Semiconductor Landscape Beyond Traditional Moore's Law Scaling
DUBLIN--(BUSINESS WIRE)--Jun 19, 2025-- The 'The Global Advanced Semiconductor Packaging Market 2025-2035" report has been added to offering. The Global Advanced Semiconductor Packaging Market 2025-2035 provides a comprehensive analysis of the rapidly evolving advanced semiconductor packaging industry, examining how technological innovations are reshaping the semiconductor landscape beyond traditional Moore's Law scaling. The report provides essential strategic intelligence for semiconductor manufacturers, packaging providers, equipment suppliers, materials companies, electronics OEMs, and investors to navigate the complex advanced packaging landscape. It identifies key innovation vectors, potential market disruptions, and strategic partnership opportunities that will shape competitive positioning through 2035. With semiconductor packaging increasingly becoming the critical enabler for next-generation electronic systems-from AI accelerators to autonomous vehicles-this report delivers the actionable insights needed to capitalize on the industry's shift from traditional monolithic approaches to heterogeneous integration and advanced packaging solutions. The advanced semiconductor packaging market is experiencing rapid growth, driven by technological demands that are pushing the industry beyond traditional Moore's Law scaling. The market's growth is underpinned by the increasing importance of packaging technologies in addressing computing demands. The telecom and infrastructure sector currently dominates the market, and the mobile and consumer segment is emerging as the fastest-growing market. 3D stack memory technologies-including HBM, 3DS, 3D NAND, and CBA DRAM-are key growth drivers. The fastest-growing platforms include CBA DRAM, 3D SoC, active silicon interposers, 3D NAND stacks, and embedded silicon bridges. These technologies are critical for meeting the increasing performance, power, and miniaturization demands of modern electronics. Heterogeneous integration and chiplet-based designs are revolutionizing semiconductor architecture. Major industry players like TSMC, Intel, AMD, and Nvidia are heavily investing in advanced packaging solutions to overcome the limitations of traditional monolithic chip designs. The adoption of hybrid bonding technologies is particularly transformative, enabling finer interconnect pitches and higher integration densities. The competitive landscape is evolving as foundries, IDMs, and OSATs vie for market share. In 2024, memory players including YMTC, Samsung, SK Hynix, and Micron. Top OSATs like ASE, SPIL, JCET, Amkor, and TF continue to provide assembly and test services while developing their high-end packaging capabilities through UHD FO and mold interposer technologies. Looking toward 2035, several trends will shape the market. The integration of chiplets using 3D SoC, 2.5D interposers, embedded silicon bridges, and co-packaged optics will create increasingly complex '3.5D' packages. Panel-level packaging is gaining traction for larger packages, offering cost advantages over wafer-level processes. Simultaneously, the industry is transitioning from micro-bump technology to bumpless hybrid bonding, enabling finer interconnect pitches necessary for advanced nodes. By application, high-performance computing, AI accelerators, data centers, and autonomous vehicles represent the fastest-growing segments. The rise of AI and cloud computing is driving demand for advanced memory packaging solutions like HBM and specialized processors requiring sophisticated heterogeneous integration. Further consolidation among suppliers is likely, with foundries and IDMs strengthening their packaging capabilities. The emergence of new players from regions like China will intensify competition, while the importance of equipment suppliers like BESI, Applied Materials, and EVG will grow with the adoption of cutting-edge bonding technologies. Report Contents include Company Profiles For more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. View source version on CONTACT: Laura Wood, Senior Press Manager [email protected] E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 KEYWORD: INDUSTRY KEYWORD: TECHNOLOGY PACKAGING SEMICONDUCTOR MANUFACTURING SOURCE: Research and Markets Copyright Business Wire 2025. PUB: 06/19/2025 07:51 AM/DISC: 06/19/2025 07:51 AM
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Business Standard
a day ago
- Automotive
- Business Standard
EV plans face 24-month delay as OEMs, suppliers hit R&D, execution limits
Around 88 per cent of India's auto component suppliers are facing severe research and development capacity constraints, and electric vehicle (EV) programmes at legacy original equipment manufacturers (OEMs) are being delayed by up to 24 months, according to a new study by Vector Consulting Group. Long and uncertain wait times for customers, poor after-sales services, and frequent product recalls are the major concerns that the EV industry is currently facing, which is resulting in the delay. The study, based on conversations with over 100 chief experience officers across OEMs and Tier-1 suppliers, finds that the sector's biggest challenge is not a lack of vision or technology, but a widespread execution breakdown across the value chain. Automakers, suppliers, and EV start-ups are discovering that traditional models of new product development, supplier engagement, and supply chain management are no longer fit for purpose. 'The bottleneck is internal: poor coordination, capacity mismatches, and execution blind spots,' said Ravindra Patki, Managing Partner at Vector Consulting Group. 'To thrive in this new era, the industry must rethink how it works—not just what it builds.' Many OEMs are attempting to manage EV and internal combustion engine (ICE) programmes in parallel, without realigning or expanding internal capacity. Engineering, procurement, and validation teams remain shared across programmes, leading to rework, bottlenecks, and chronic delays. Even where dedicated EV teams exist, they often depend on legacy internal systems, reducing their ability to move quickly. Tier-1 suppliers face similar pressure. They are expected to support multiple complex programmes across multiple OEMs at once, often with limited visibility into volume forecasts or product timelines. As a result, suppliers are forced to deal with late-stage design changes, increasing risk, cost, and strain on an already stretched engineering bandwidth. 'If OEMs want reliable delivery, they must involve suppliers early, align them on product priorities, and integrate them into the decision-making process—not just the sourcing cycle,' added Patki. Start-ups, though free from ICE legacies, are not immune to execution challenges. Many over-promise on launch timelines and rely on digital workarounds—such as over-the-air (OTA) updates—to fix post-launch engineering issues. While agile in theory, this approach often leads to short-term fixes that hurt long-term brand trust and increase costs, the study notes. For a solution, the report recommends a fundamental reset in OEM-supplier collaboration. Vector calls for stakeholders to move beyond transactional, cost-down relationships to co-development partnerships. This involves shared risks, earlier design engagement, and common execution targets. It also includes setting up integrated OEM-supplier programme teams and using real-time product-maturity dashboards to reduce friction and delays. 'The winners of the next decade won't be those with the flashiest prototypes, but those who can launch, scale, and improve faster than others,' said Patki. 'That's why the industry must stop patching old systems and start building new ones.'
