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Business Upturn
16-05-2025
- Business
- Business Upturn
Flip Chip Market Size to Worth USD 48.70 Billion by 2032, Driven by Demand for High-Performance Electronics and Advanced Semiconductor Packaging
Austin, May 16, 2025 (GLOBE NEWSWIRE) — Flip Chip Market Size & Growth Insights: According to the SNS Insider,'The Flip Chip Market Size was worth USD 30.61 billion in 2023 and is expected to grow to USD 48.70 billion by 2032, at a compound annual growth rate (CAGR) of 5.40% over the forecast period from 2024 to 2032.' Rising Demand for Advanced Electronics Accelerates Flip Chip Market Growth The Flip Chip Market is experiencing strong demand, as advanced semiconductor devices are increasingly being integrated into consumer electronics. With the increasing requirement for cost-effective, high-density, energy-efficient, and portable electronic products, like smartphones, tablets, and wearables etc., flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip technology into CPUs, GPUs and chipsets to satisfy the growing demand for higher processing power. And with quick growth of IoT as well as AI enabled devices, there is an urgent demand for advanced interconnection technologies in chips, which also promotes the penetration of flip U.S. market, valued at USD 4.46 billion in 2023, is expected to grow at a CAGR of 5.95%, owing to favorable R&D investments and some of the world's established technological infrastructures. In totality, these factors make flip chip packaging as a required element for global electronics innovation in the coming years. Get a Sample Report of Flip Chip Market Forecast @ Leading Market Players with their Product Listed in this Report are: Amkor Technology –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) Intel Corporation –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) Fujitsu –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) Taiwan Semiconductor Manufacturing Company Limited (TSMC) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) Texas Instruments Incorporated – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) SAMSUNG – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) ASE Technology Holding Co., Ltd. – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) Advanced Micro Devices, Inc. (AMD) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) APPLE INC. – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) Powertech Technology Inc. – (Flip Chip BGA Services, Wafer Level Flip Chip Packaging) Flip Chip Market Report Scope: Report Attributes Details Market Size in 2023 USD 30.61 Billion Market Size by 2032 USD 48.70 Billion CAGR CAGR of 5.40% From 2024 to 2032 Report Scope & Coverage Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook Key Segmentation •By Packaging Technology- ( 3D,2.5D,2.1D)•By Bumping Technology-(Copper Pillar,Tin-Lead Eutectic Solder,Lead-Free Solder,Gold Stud Bumping) •By End-use – (Military and Defense,Medical and Healthcare,Industrial Sector,Automotive,Consumer Electronics,Telecommunications ) Key Drivers • Growing Integration of Advanced Semiconductor Devices in Consumer Electronics Fuels Flip Chip Market Growth. • Emerging Applications in Automotive Electronics and 5G Infrastructure Create Lucrative Opportunities for Flip Chip Technology. Purchase Single User PDF of Flip Chip Market Report (20% Discount) @ Key Industry Segmentation By Packaging Technology In 2023, the 2.5D packaging segment held the largest share of the Flip Chip Market at 45.60%, as it is a cost-effective and allows for the mounting of several dies on an interposer, which provides better thermal and electrical performance. Companies including Intel and AMD serve high-performance processors with 2.5D ICs, and the ASE Group and TSMC are serving AI and data centers with 2.5D solutions. The 3D packaging segment is projected to grow at the highest CAGR of 7.14%, driven by the desire to achieve ultra-high-density integrations in portable consumer devices including smartphones, AR/VR, and AI processors. New technologies, such as Intel's Foveros and Samsung's X-Cube, are enabling faster adoption by enabling reduced size and power while improving performance. By Bumping Technology The Copper Pillar segment led the Flip Chip Market in 2023 with a dominant 61.36% revenue share, driven by its superior electrical performance, thermal management, and fine-pitch capability, making it ideal for high-density applications like processors, FPGAs, and memory devices. Industry players like TSMC and Amkor Technology have advanced their copper pillar bumping technologies to meet growing demands in AI and 5G chip packaging. The Gold Stud Bumping segment is projected to grow at the highest CAGR of 7.79%, owing to the advantages of low-temperature bonding, and lower contamination rate, especially in precision-guided applications such as medical devices, aerospace, and military electronics. By End-use In 2023, Consumer Electronics held the largest revenue share in the Flip Chip Market at 39.64%, driven by rising demand for compact, high-performance devices like smartphones, tablets, and wearables. Flip chip technology enhances processing speed and thermal performance, making it ideal for these applications. Companies like Apple, Samsung, Intel, and ASE Technology continue to adopt and advance flip chip packaging to meet evolving consumer needs. The Automotive segment is set to grow at the highest CAGR of 7.46%, driven by electronics in advanced driver-assistance systems, infotainment, electric vehicle, and autonomous systems. NXP and Infineon are at the forefront of this enabling technology with automotive grade flip chip solutions. Asia Pacific Leads Flip Chip Market While North America Emerges as Fastest-Growing Region In 2023, Asia Pacific dominated the Flip Chip Market with a 42.39% revenue share, due to the existence of big semiconductor manufacturing countries such as Taiwan, South Korea, China, and Japan. Prominent TSM companies such as TSMC, Samsung Electronics, and ASE Technology Riviera further foster innovation in flip chip packaging through their investments in advanced packaging, including high-density production lines. North America is projected to grow at the fastest CAGR of 7.07%, supported by strong R&D investments and increasing demand in AI, automotive, and high-performance computing. Companies like Intel and AMD are advancing next-gen packaging technologies such as EMIB and Foveros, while government initiatives like the CHIPS Act bolster domestic semiconductor production, further accelerating market growth in the region. Do you have any specific queries or need any customized research on Flip Chip Market? Submit your inquiry here @ Recent Developments: In May 2025, Samsung is expected to power the Galaxy Z Flip 7 with its in-house Exynos 2500 chipset. This marks the first use of Exynos in a foldable, replacing the previously expected Snapdragon chip. In May 2025, MediaTek's next-generation flagship SoC and Arm-based processors drive the outsourced semiconductor assembly and test market, helping ASE rake in a year's worth of packaging tool orders in a single quarter. Table of Contents – Major Points 1. Introduction 2. Executive Summary 3. Research Methodology 4. Market Dynamics Impact Analysis 5. Statistical Insights and Trends Reporting 5.1 Technology Adoption Rate (2023) 5.2 Patent Filing Trends (2023) 5.3 Capital Investments (2023) 5.4 Battery Performance Metrics (2023) 5.5 Production Capacity Utilization (2023) 6. Competitive Landscape 7. Flip Chip Market Segmentation, by Packaging Technology 8. Flip Chip Market Segmentation, by Bumping Technology 9. Flip Chip Market Segmentation, by End-Use 10. Regional Analysis 11. Company Profiles 12. Use Cases and Best Practices 13. Conclusion About Us: SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company's aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world. Disclaimer: The above press release comes to you under an arrangement with GlobeNewswire. Business Upturn takes no editorial responsibility for the same.
Yahoo
30-04-2025
- Business
- Yahoo
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Highlights: Significantly expanded portfolio of Cadence design IP optimized for Intel's advanced technologies AI-driven digital and analog/custom EDA solutions certified for Intel 18A technology PDK, delivering optimized PPA Co-developed advanced packaging reference design flow for Intel Foundry's EMIB and EMIB-T technology certified for latest PDK Engagement underway on early design technology co-optimization for Intel 14A-E Joins the Intel Foundry Chiplet Alliance as a founding member SAN JOSE, Calif., April 29, 2025--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK). These advancements are being showcased today at Intel Foundry Direct Connect, underscoring Cadence's continued leadership in driving industry innovation for artificial intelligence and machine learning (AI/ML), high-performance computing (HPC) and advanced mobility applications through its strategic partnership with Intel Foundry. Cadence has collaborated closely with Intel Foundry to design and optimize a comprehensive range of solutions that fully leverage the innovative features of the Intel 18A/18A-P nodes, including RibbonFET Gate-all-around transistors and PowerVia backside power delivery network. With this collaboration, joint customers can achieve exceptional power, performance and area (PPA) efficiencies, accelerating time to market for cutting-edge system-on-chip (SoC) designs. The latest additions to Cadence's broad portfolio of design IP in Intel 18A/18A-P technologies are available shortly and include: 224G SerDes with long-range performance for Universal Accelerator Link™ (UALink™) and Ultra Ethernet™, the latest standards for scaling up and out accelerator networks in AI factories DDR5 – 12.8G with MRDIMM Gen2 support, supporting the latest in DRAM technology for AI applications Universal Chiplet Interconnect Express™ (UCIe™) 1.1 48G, which seamlessly facilitates multi-die system-in-package (SiP) integration for scalable chiplet architectures at high data rates Advanced computing and peripheral connectivity IP compatible with the latest consumer standards, enabling scalable embedded applications for a wide range of consumer and mobility requirements: 10G multi-protocol SerDes PHY, supporting PCI Express® (PCIe®) 3.0, DisplayPort and Ethernet eUSB2 v2.0 MIPI® SoundWire® I3S Cadence's expanded portfolio also includes a range of design IP already available in the Intel 18A technology family: 112G Extended Long-Reach SerDes with superior bit error rate (BER) performance for robust data integrity over longer distances; 64G MP PHY for PCIe 6.0, CXL 3.0 and 56G Ethernet; LPDDR5X/5 – 8533 Mbps with multi-standard support; and UCIe 1.0 16G for advanced packaging. Mutual customers now have a broad range of IP options for their AI/ML, HPC and mobility applications leveraging Intel 18A/18A-P RibbonFET and PowerVia implementation. In addition to the new IP for Intel 18A and 18A-P technologies, Cadence's comprehensive suite of AI-driven design and analog/custom design solutions has been certified for the latest Intel 18A node PDK. This includes the complete AI-driven Cadence RTL-to-GDS flow, featuring a range of robust solutions such as the Cadence Cerebrus® Intelligent Chip Explorer, Genus™ Synthesis Solution, Innovus™ Implementation System, Quantus™ Extraction Solution, Quantus Field Solver, Tempus™ Timing Solution and Pegasus™ Verification System. The flow also includes custom IC design solutions such as Cadence Virtuoso® Studio, the integrated Spectre® Platform and the Voltus™-XFi Custom Power Integrity Solution. Meanwhile, Cadence and Intel Foundry are engaging in early design technology co-optimization for Intel 14A-E to establish the readiness of Cadence EDA flows for the next-generation advanced node. In addition, Cadence and Intel Foundry have also partnered to develop an advanced packaging workflow leveraging Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology. This solution streamlines the integration of complex multi-chiplet architectures—eliminating data conversion, shortening design cycles and enabling concurrent activities with early thermal, signal integrity and power modeling. It also ensures compliance with standards, reduces risks and simplifies adoption of Intel technology. Continuing its support of the Intel Foundry Accelerator Alliance Program, Cadence has joined the Intel Foundry Chiplet Alliance Program as a founding member to ensure its solutions will help provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. Cadence is already a participating member in the EDA, IP, Design Services and USMAG Alliances. "Cadence is at the forefront of facilitating next-generation AI, HPC and mobility designs with Intel 18A and 18A-P technologies, and our collaboration ensures that our mutual customers can leverage our robust design IP and AI-driven digital and analog/custom solutions for unparalleled performance and efficiency," said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. "Our expanded design IP portfolio for Intel Foundry builds on our commitment to delivering best-in-class silicon solutions, and our advanced implementations of leading standards are key to achieving scalable, high-performance designs. We look forward to continuing to partner with Intel Foundry to build out IP solutions for the AI factories and compute platform needs of the future as well as today." "As we optimize solutions through our ongoing collaboration, the combination of Cadence's innovative IP solutions and Intel 18A and 18A-P technologies delivers advantages for AI/ML and HPC applications," stated Suk Lee, vice president and general manager, Ecosystem Technology Office at Intel Foundry. "Working together, we are accelerating the development of high-performance solutions, including for chiplets, that meet the evolving needs of the industry and empower our mutual customers to drive PPA efficiencies and accelerate time to market for their innovative next-generation SoC designs." For more information about Cadence and its collaboration with Intel Foundry, please visit the Intel Foundry partner webpage. About Cadence Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence's Intelligent System Design™ strategy, are essential for the world's leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world's top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at © 2025 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at are trademarks or registered trademarks of Cadence Design Systems, Inc. MIPI and SoundWire are registered trademarks owned by MIPI Alliance. PCI Express and PCIe are registered trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are trademarks of UCIe Consortium. All other trademarks are the property of their respective owners. Category: Featured View source version on Contacts For more information, please contact: Cadence Newsroom408-944-7039newsroom@ Sign in to access your portfolio
