30-04-2025
Intel Foundry Unveils New Process and Packaging Updates
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Intel Foundry hosted its Direct Connect 2025 event, revealing progress across process technology, advanced packaging, and manufacturing. The company also introduced new ecosystem programs and partnerships that support its systems foundry strategy.
CEO Lip-Bu Tan opened the event, highlighting Intel Foundry's commitment to building a world-class systems foundry. He emphasized customer trust and the importance of an engineering-first culture. Other keynote speakers included Naga Chandrasekaran, chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services.
Throughout the day, Intel executives were joined by leaders from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm. They discussed collaborative efforts to help customers bring innovative products to market.
Key Announcements
Process Technology Intel Foundry shared early access to its new Intel 14A Process Design Kit (PDK).
Multiple customers plan to build test chips on Intel 14A, the successor to Intel 18A.
Intel 14A will feature PowerDirect, an enhancement over Intel 18A's PowerVia.
Intel 18A is in risk production and will enter volume manufacturing this year.
Two variants, Intel 18A-P and 18A-PT, are now in development. Intel 18A-P offers broader performance. Intel 18A-PT uses hybrid bonding with sub-5µm pitch.
Intel's first 16nm tape-out is in the fab, with work underway on 12nm nodes in partnership with UMC.
Advanced Packaging New offerings include EMIB-T, Foveros-R, and Foveros-B.
These technologies enhance 3D stacking and high-bandwidth memory support.
Intel is partnering with Amkor to expand packaging flexibility for customers.
Manufacturing Intel's Arizona Fab 52 has processed its first 18A wafer.
Volume production for 18A will begin in Oregon, with Arizona to follow.
Intel 14A and 18A production will remain U.S.-based.
Ecosystem Development Intel added new programs to its Foundry Accelerator Alliance.
The new Intel Foundry Chiplet Alliance focuses on secure chiplet infrastructure.
It aims to support government and commercial applications.
The event demonstrated Intel Foundry's growing momentum across multiple fronts. With updates on process nodes, packaging technologies, domestic manufacturing, and ecosystem alliances, Intel continues to position itself as a strong player in the global semiconductor space.
Intel Foundry plans to scale these capabilities further to support customers seeking trusted, U.S.-based manufacturing with advanced technology.
