Latest news with #CMOS
Express Tribune
5 days ago
- Science
- Express Tribune
Penn State's 2D computer marks breakthrough in post-silicon computing
Engineers at Pennsylvania State University have constructed the world's first computer entirely made from atomically thin two-dimensional materials, bypassing silicon entirely in a step researchers say could pave the way for more compact, efficient electronics. The development process was published in Nature. The new device is a functioning complementary metal-oxide semiconductor (CMOS) computer built using two 2D materials—molybdenum disulfide for n-type transistors and tungsten diselenide for p-type transistors. These transistors are fundamental to regulating current in CMOS circuits, which underpin nearly all modern computing. 'This marks the first time a computer has been built entirely from 2D semiconductors,' said Dr. Saptarshi Das, a professor of engineering at Penn State and the project's lead. He added that while traditional silicon loses performance at atomic scales, 'two-dimensional materials maintain their exceptional electronic properties at these thicknesses." The fabrication process used metal-organic chemical vapour deposition (MOCVD), a technique that produces ultra-thin material layers. The team produced more than 1,000 of each transistor type and adjusted their threshold voltages to create a fully functional CMOS logic circuit. Though the prototype computer currently operates at modest speeds of up to 25 kilohertz—far slower than commercial silicon chips—it represents a proof of concept. 'Our 2D CMOS computer operates at low voltages with minimal power consumption,' said Subir Ghosh, a doctoral researcher and lead author of the study. Designed as a one-instruction-set computer, the prototype is not aimed at immediate commercial use but lays crucial groundwork for future flexible, lightweight, and energy-efficient devices.
Yahoo
10-06-2025
- Automotive
- Yahoo
Sony Semiconductor Solutions to Release Stacked SPAD Depth Sensor for Automotive LiDAR Applications, Delivering High-Resolution, High-Speed Performance
High-resolution, high-speed distance measuring performance contributes to safer, more reliable future mobility ATSUGI, Japan, June 9, 2025 /PRNewswire/ -- Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the IMX479 stacked, direct Time of Flight (dToF) SPAD depth sensor for automotive LiDAR systems, delivering both high-resolution and high-speed performance. The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology. In addition, SSSs proprietary device structure enables a frame rate of up to 20 fps*1, which is the fastest for such a high-resolution SPAD depth sensor having 520 dToF pixels.*2 The new product enables the high-resolution and high-speed distance measuring performance demanded for an automotive LiDAR required in advanced driver assistance systems (ADAS) and automated driving (AD), contributing to safer and more reliable future mobility. Model name Sample shipment date (planned) Sample price (including tax)*3 IMX479 1-type (15.8 mm diagonal) 520-dToF-pixel SPAD depth sensor Autumn 2025 ¥35,000 LiDAR technology is crucial for the high-precision detection and recognition of road conditions and the position and shape of the objects, such as vehicles, pedestrians. There is a growing demand for further technical advancements and developments progress in LiDAR toward Level 3 automated driving, which allows for autonomous control. SPAD depth sensors use the dToF measurement method, one of the LiDAR ranging methods, that measures the distance to an object by detecting the time of flight (time difference) of light emitted from a source until it returns to the sensor after being reflected by the object. The new sensor harnesses SSS's proprietary technologies acquired in the development of CMOS image sensors, including the back-side illuminated, stacked structure and Cu-Cu (copper-copper) connections.*4 By integrating the newly developed distance measurement circuits and dToF pixels on a single chip, the new product has achieved a high-speed frame rate of up to 20 fps while delivering a high resolution of 520 dToF pixels with a small pixel size of 10 μm square. Main Features Up to 20 fps frame rate, the fastest for a 520 dToF pixel SPAD depth sensor*2This product consists of a pixel chip (top) with back-illuminated dToF pixels and a logic chip equipped with newly developed distance measurement circuits (bottom) using a Cu-Cu connection on a single chip. This design enables a small pixel size of 10 μm square, achieving high resolution of 520 dToF pixels. The new distance measurement circuits handle multiple processes in parallel for even better high-speed technologies achieve a frame rate of up to 20 fps, the fastest for a 520 dToF pixel SPAD depth sensor.*1 They also deliver capabilities equivalent to 0.05 degrees vertical angular resolution, improving the vertical detection accuracy by 2.7 times that of conventional products.*5 These elements allow detection of three-dimensional objects that are vital to automotive LiDAR, including objects as high as 25 cm(such as a tire or other objects in the road) at a distance of 250 m. Excellent distance resolution of 5 cm intervalsThe proprietary circuits SSS developed to enhance the distance resolution of this product individually processes each SPAD pixel data and calculates the distance. Doing so successfully improved the LiDAR distance resolution to 5 cm intervals. High, 37% photon detection efficiency enabling detection of objects up to a distance of 300 mThis product features an uneven texture on both the incident plane and the bottom of the pixels, along with an optimized on-chip lens shape. Incident light is diffracted to enhance the absorption rate to achieve a high, 37% photon detection efficiency for the 940 nm wavelength, which is commonly used on automotive LiDAR laser light sources. It allows the system to detect and recognize objects with high precision up to 300 m away even in bright light conditions where the background light is at 100,000 lux or higher. Key Specifications Model name IMX479 Effective SPAD pixels 105 × 1,568 pixels (H × V), approx. 164,000 pixels Vertical effective dToF pixel count 520 dToF pixels Image size Diagonal 15.8 mm (1-type) Recommended light source wavelength 940 nm SPAD unit cell size 10.08 μm × 10.08 μm (H × V) Element size (dToF pixel unit) Minimum 3 × 3 (H × V) Photon detection efficiency 37% (940 nm wavelength) Response speed Approx. 6 ns Power supply SPAD breakdown voltage −20.5V SPAD excess voltage 3.3V Analog 3.3V Digital 1.125V Interface 1.8V Interface MIPI CSI-2 serial output (4 lane) Chip size 12.2 mm × 20.0 mm (H × V) Max. detection distance 300 m Distance precision at 300 m Minimum 5 cm equivalent Mechanical scan LiDAR for evaluating the productSSS has developed a mechanical scanning*6 LiDAR unit equipped with this new sensor for product evaluation, which will be provided to customers and partners. This will contribute to customer and partner LiDAR development and product evaluation initiatives. *1 The frame rate may vary depending on horizontal FoV (Field of View) and its resolution.*2 According to SSS research (as of announcement on Jun 10, 2025)*3 Differs depending on the handling quantity.*4 A technology used when a pixel chip (top) is stacked with a logic chip (bottom), to achieve electrical continuity by connecting the Cu (copper) pads to each other. This increases the flexibility in the design, improves productivity, and enables a smaller size and higher performance compared with Through-Silicon Vias (TSV), where the upper and lower chips are connected via electrodes around the circumference of the pixel area*5 Compared with SSS' IMX459 1/2.9-type 100,000-effective pixel SPAD depth sensor.*6 A method in which a rotating mirror reflects the beam from a fixed laser light source for wide area horizontal scanning. 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Yahoo
02-06-2025
- Business
- Yahoo
Here's Why Broadcom Inc. (AVGO) is a Strong Growth Stock
It doesn't matter your age or experience: taking full advantage of the stock market and investing with confidence are common goals for all investors. Achieving those goals is made easier with the Zacks Style Scores, a unique set of guidelines that rates stocks based on popular investing methodologies, namely value, growth, and momentum. The Style Scores can help you narrow down which stocks are better for your portfolio and which ones can beat the market over the long-term. Growth investors build their portfolios around companies that are financially strong and have a bright future, and the Growth Style Score helps take projected and historical earnings, sales, and cash flow into account to uncover stocks that will see long-term, sustainable growth. Broadcom is a premier designer, developer and global supplier of a broad range of semiconductor devices with a focus on complex digital and mixed signal complementary metal oxide semiconductor (CMOS) based devices and analog III-V based products. AVGO is a Zacks Rank #2 (Buy) stock, with a Growth Style Score of A and VGM Score of B. Earnings are expected to grow 36.1% year-over-year for the current fiscal year, with sales growth of 21.2%. One analyst revised their earnings estimate upwards in the last 60 days for fiscal 2025. The Zacks Consensus Estimate has increased $0.01 to $6.63 per share. AVGO boasts an average earnings surprise of 3.4%. Broadcom Inc. is also cash rich. The company has generated cash flow growth of 15.8%, and is expected to report cash flow expansion of 36.1% in 2025. With solid fundamentals, a good Zacks Rank, and top-tier Growth and VGM Style Scores, AVGO should be on investors' short lists. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Broadcom Inc. (AVGO) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research
Yahoo
27-05-2025
- Business
- Yahoo
Teledyne Launches New Industrial Image Sensors Designed for Space Applications
Teledyne Technologies Incorporated (NYSE:TDY) has announced today the release of three industrial CMOS image sensors designed for space applications, marking a strategic expansion into the rapidly growing New Space market. Developed and tested in France and Spain, these sensors range in resolution from 1.3MP to 67MP and are tailored for high-demand applications such as Earth observation, star trackers, rover cameras, and space situational awareness. A technician in a lab coat calibrating advanced electronic components. The launch represents a key growth opportunity for TDY's Digital Imaging division, as it seeks to capture share in a segment where cost-effective but high-quality components are in high demand. The new sensors offer space-ready performance without the full cost and lead time of traditional space-grade parts, making them ideal for agile missions and constellations. The launch is expected to boost the growth pace of TDY's largest Digital Imaging segment, which accounts for more than half of total revenues but has posted just +2.2% revenue growth in the latest quarter, the slowest among all segments. These developments position TDY well to beat the modest street consensus expecting only +6.6% revenue growth for the FY2025. Teledyne Technologies Incorporated (NYSE:TDY) will present its new sensors at SmallSat Europe 2025 in Amsterdam later this week, highlighting management's intent to solidify the company's role as a key supplier in the New Space value chain. TDY stock is up +6% year-to-date, outperforming the broad market, which indirectly confirms that the strengthening moat and growth prospects are already starting to be priced in. Teledyne Technologies Incorporated (NYSE:TDY) is a leading provider of advanced imaging solutions used in instrumentation, aerospace, and defense applications. While we acknowledge the potential of TDY as an investment, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an AI stock that is more promising than TDY and that has 100x upside potential, check out our report about this cheapest AI stock. READ NEXT: and Disclosure: None. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Associated Press
26-05-2025
- Business
- Associated Press
Teledyne Space Imaging Launches Industrial Image Sensors Tested for Space
GRENOBLE, FRANCE - Media OutReach Newswire - 26 May 2025 - Teledyne Technologies Incorporated (NYSE:TDY), a leading provider of advanced imaging solutions, is proud to announce the release of three variants of industrial CMOS sensors, with resolutions ranging from 1.3MP up to 67MP, following a delta space qualification methodology and radiation testing. These industrial image sensors are designed, manufactured and tested in Grenoble-France and Seville-Spain and upscreened for space in the Grenoble facilities. The Upscreened Variants (USV) are intended to be suitable for new space applications such as Earth observation and remote sensing payloads, star trackers, monitoring cameras, and cameras for space suits, rovers, moon landers, and space situational or domain awareness. These new products complement Teledyne's ongoing offerings for demanding science and defense missions by providing options for the less rigorous New Space market. Upscreened Pdt Launch PR 'Within the New Space industry, some system designers may use COTS sensors and make them fly with no upscreening, which means that they take the risk of any malfunctions or errors further down the line,' explains Céline Semécas, Product Marketing Manager, Teledyne e2v. 'Teledyne e2v's industrial upscreened image sensors are tested for space and are delivered as flight models with lot validation test certificates and radiation test reports.' The three CMOS sensors will undergo full screening, serialization and lot validation tests. Depending on the mission profile, they are delivered as flight models with two levels of screening, according to U1 (ESCC9020-like) or U3 (NASA Class 3 tailored for image sensors). Devices were sampled and have been through radiation characterization in specialized facilities, including testing for Single Event Latch-up (SEL), Single Event Effect (SEE), and Single Event Functional Interrupt (SEFI) malfunctions or errors. The image sensors feature a broad range of embedded functions, including sub-sampling, multi-region of interest (ROI), defective pixel correction, and high dynamic range capability. For satellite star trackers and monitoring cameras, the Ruby 1.3M USV is a radiation tolerant 1.3MP (1280 x 1024) global shutter sensor optimized for space systems that are subject to constraints, such as size, weight and power (SWaP) and cost. Housed in a 12.7mm x 12.7mm CLCC packaging, this 5.3µm pixel pitch sensor can fit with cost-effective 1/1.8" lenses, consumes very low (≤200mW) power, and is available in a monochrome or colour version. The Emerald Gen2 12M USV is a compact 12MP (4096 x 3072) global shutter imaging sensor for monitoring cameras with a 2.8µm pitch, and available in monochrome and colour versions. It features a very low readout noise performance of less than 3 electrons, delivering excellent image quality and the ability to work in high-contrast scenes. It has ROI features, enabling Teledyne e2v to offer an 8.9MP ROI image sensor in the same packaging, allowing space engineers to make even smaller cameras because they can use smaller optics. This sensor also features both LVDS and MIPI outputs, which ease the integration. The Emerald 67M USV is a 67MP (8192 x 8192) image sensor that features one of the smallest global shutter pixel pitches (2.5µm) on the market. This 8K high-resolution device can cover a large swath for Earth observation and is also suitable for space domain awareness applications, allowing them to cover a large field of view. Emerald 67M USV combines low noise (<3e- @ 12 bits), providing excellent image quality in low light conditions, and up to 65 fps @10 bits, providing sharp images at very high speed. The image sensor can support monochrome or colour video and can be used for multispectral imaging. Teledyne e2v provides a full range of tools to ease system integration of the CMOS sensors and accelerate time-to-market. These tools include evaluation kits, reference designs, radiation reports and space qualification reports. 'With a dedicated support team and quick response times, Teledyne e2v in Grenoble supports space engineers from design concept to system launch,' adds Céline Semécas. 'Furthermore, Teledyne e2v is used to managing long-term supplies with applications that require long product life cycles and obsolescence management.' During SmallSat Europe 2025, Europe's leading event dedicated to small satellites, which will take place on May 27 and 28 at the RAI Convention Center in Amsterdam, visitors to the Teledyne stand, at booth 737, can watch a live demo showcasing the performance characteristics of the new Emerald Gen2 12M USV upscreened image sensors. Hashtag: #Teledyne The issuer is solely responsible for the content of this announcement. Teledyne Space Imaging Teledyne Space Imaging offers innovative space imaging products, including those from sister companies. This new line of industrial image sensors upscreened for space is from Teledyne e2v in Grenoble. This facility is known for its high-performance, high-reliability semiconductors for the most demanding space applications. Teledyne Space Imaging is part of Teledyne Technologies, a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne's operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne's websites: and
