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VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones
VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

Yahoo

time12-06-2025

  • Business
  • Yahoo

VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

Providing architecture design, software-hardware co-development, and mass production support, and enhancing AI-powered imaging capabilities in smart devices SHANGHAI, June 12, 2025--(BUSINESS WIRE)--VeriSilicon ( recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer's mass-produced smartphones, reaffirming the company's comprehensive one-stop custom silicon service capabilities in AI vision processing. VeriSilicon's AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics. For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer's specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer's main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon's robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification. "AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions," said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. "With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer's chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions." About VeriSilicon VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: View source version on Contacts Media Contact: press@ Sign in to access your portfolio

AMD is allegedly working on Arm-based "Sound Wave" APUs for Microsoft's Surface laptops next year
AMD is allegedly working on Arm-based "Sound Wave" APUs for Microsoft's Surface laptops next year

Yahoo

time11-06-2025

  • Yahoo

AMD is allegedly working on Arm-based "Sound Wave" APUs for Microsoft's Surface laptops next year

When you buy through links on our articles, Future and its syndication partners may earn a commission. AMD is allegedly working on an Arm-based SoC, codenamed "Sound Wave", in a bid to power Microsoft's Surface laptops next year, claims Kepler via ITHome. Moving away from traditional x86 designs, Sound Wave is reported to feature the Arm ISA and will likely leverage off-the-shelf Cortex cores. Details on exact specifications, availability, and pricing remain under wraps, so it's wise to approach this leak with caution. Looking beyond its historical Wintel roots, Microsoft has made a clear push towards the WoA (Windows on Arm) platform. This was put into effect with the firm's partnership with Qualcomm, which yielded the Snapdragon X family. This was likely a significant catalyst that motivated Intel to engineer an efficiency-first alternative: Lunar Lake. In fact, even Nvidia is entering the WoA space with its rumored N1 family of SoCs, developed in partnership with MediaTek. The strong success of the Nintendo Switch, powered by Nvidia hardware, underlines a lucrative market for Arm-based handhelds. These Sound Wave SoCs, if true, could be a foundation for the Steam Deck 2, but I must emphasize this is highly speculative. Microsoft's current-generation Surface Pro 11 and Surface 7 laptops are powered by chips from Qualcomm and Intel. AMD's existing gap in efficiency compared to Snapdragon X, Lunar Lake, and likely soon-to-launch N1 offerings could be bridged with these Arm-based SoCs. It is suggested these APUs will slot into the FF5 socket, succeeding FF3, which is home to the Steam Deck's Aerith/Sephiroth APUs. Regarding the integrated graphics, AMD should continue to employ its established Radeon IP instead of adopting Arm's Mali graphics solutions. Lunar Lake sticks to x86 roots, and while it might be inferior in performance to Arm-based equivalents from Qualcomm and Apple, it comes extremely close in efficiency, even exceeding them in battery endurance tests. That being said, Lunar Lake wasn't exactly cheap for Intel, including expensive manufacturing with TSMC's N3B process, Foveros 3D packaging, on-package LPDDR5x-8533 RAM, and next-generation IP blocks like Xe2-LPG for graphics. This is why ex-CEO Pat Gelsinger characterized Lunar Lake as an expensive one-off design. So, AMD's decision could be driven by the high costs and complexities associated with building an ultra-efficient x86 design, especially for the sub-10W range, and Microsoft's growing push for Windows on Arm and AI-first PCs. Likewise, can Microsoft address the teething optimization and compatibility issues that still plague the WoA ecosystem by then? We should reserve our judgments until AMD actually reveals these products, assuming they're even in the pipeline. While AMD could reveal more at CES 2026, we'll probably have to wait a bit longer as Microsoft tends to announce new Surface products during the summer season. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.

VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones
VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

Yahoo

time09-06-2025

  • Business
  • Yahoo

VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

Providing architecture design, software-hardware co-development, and mass production support, and enhancing AI-powered imaging capabilities in smart devices SHANGHAI, June 09, 2025--(BUSINESS WIRE)--VeriSilicon ( recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer's mass-produced smartphones, reaffirming the company's comprehensive one-stop custom silicon service capabilities in AI vision processing. VeriSilicon's AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics. For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer's specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer's main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon's robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification. "AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions," said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. "With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer's chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions." About VeriSilicon VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: View source version on Contacts Media Contact: press@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones
VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

Business Wire

time09-06-2025

  • Business
  • Business Wire

VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones

BUSINESS WIRE)--VeriSilicon ( recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer's mass-produced smartphones, reaffirming the company's comprehensive one-stop custom silicon service capabilities in AI vision processing. For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer's specific requirements. VeriSilicon's AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics. For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer's specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer's main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon's robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification. 'AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,' said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. 'With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer's chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.' About VeriSilicon

Cellebrite DI Ltd. (CLBT) to Acquire Corellium
Cellebrite DI Ltd. (CLBT) to Acquire Corellium

Yahoo

time06-06-2025

  • Business
  • Yahoo

Cellebrite DI Ltd. (CLBT) to Acquire Corellium

Cellebrite DI Ltd. (NASDAQ:CLBT) makes a move to acquire Corellium, a developer of Arm-based virtualization software. The transaction is valued at $170 million in cash, plus up to $30 million in contingent consideration, and reflects the company's deepening footprint across the mobile security and digital intelligence spectrum. A female engineer in a datacenter, wearing a headset, monitoring digital data. The acquisition of Corellium introduces mobile vulnerability research tools, smart device DevSecOps, and virtual device testing, thereby complementing Cellebrite DI Ltd. (NASDAQ:CLBT)'s plan to expand beyond traditional digital investigations. The company's Interim CEO, Thomas E. Hogan, has further made the following statement. 'The combination of our respective talent and IP changes the game in the efficient securing and analysis of all Arm-based devices.' Cellebrite DI Ltd. (NASDAQ:CLBT)'s shares opened at $16.85 today. The acquisition is pending regulatory approval and is expected to close this summer. This timing stands close to the company's plans to announce the appointment of the permanent CEO. Though the stock's monthly performance has declined by 11.94%, its weekly performance has seen an uptick of 2.18%, potentially influenced by the acquisition buzz. The Israeli company, Cellebrite DI Ltd. (NASDAQ:CLBT), established under the telecommunications and digital intelligence industries, offers advanced digital forensics tools to law enforcement, intelligence agencies, and enterprises worldwide. With a market capitalization of $4.06 billion, the company is best known for its flagship product series, Cellebrite UFED. While we acknowledge the potential of CLBT as an investment, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an extremely cheap AI stock that is also a major beneficiary of Trump tariffs and onshoring, see our free report on the best short-term AI stock. READ NEXT: 10 Unstoppable Dividend Stocks to Buy Now and 11 Oversold Global Stocks to Buy According to Hedge Funds Disclosure: None. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

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