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Business Wire
7 hours ago
- Business
- Business Wire
OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) , in collaboration with NTT Innovative Devices Corporation (Headquarters: Kanagawa Prefecture; President & CEO: Hidehiro Tsukano; 'NTT Innovative Devices' hereinafter), has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) (Note 1) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) (Note 2) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields. Terahertz devices are anticipated to play a core technology role in supporting high-capacity low-latency communications for the next-generation 6G communication standard and high-precision non-destructive inspection for improved safety. Based on these results, both companies are working on product development, aiming to start mass production in FY2026. This co-creation work has established mass production technology for high-power terahertz devices and made real-world implementation a reality. Terahertz waves are electromagnetic waves in the range between radio waves and visible light, having both the penetrating characteristics of radio waves and the straight-line propagation of light. Due to their non-invasiveness (Note 3) to the living body, which is a problem with X-ray inspection technology, terahertz waves are anticipated to be developed for applications in fields including non-destructive inspection and security. In wireless communication applications, higher carrier frequencies contribute to increased communication capacity. On the other hand, terahertz waves have the drawback of being significantly attenuated in the atmosphere, creating the need for the development of high-power terahertz devices. Establishing mass production technologies is also essential to moving forward with real-world implementation. To address these challenges, NTT Innovative Devices has been working to improve the performances (output power, output spectrum and so on) of the UTC-photomixers (Note 4). Particularly in wireless communications, to propagate standard multilevel modulation signals (Note 5) over long distances, it is essential to achieve high output power at 1dB compression (Note 6). In order to achieve the high output power at 1dB compression, NTT Innovative Devices and a Japanese university team focused on the heat dissipation characteristics of the device and studied the technology of bonding InP-based UTC-PDs directly onto SiC with high heat dissipation characteristics (Note 7). It paved the way to realize UTC-photomixers offering an approximately ten-fold performance increase (the output power at 1dB compression exceeding 1 mW) compared to conventional devices. In wafer bonding, due to the large bonding area, even a minute bonding defect at one location can cause a bonding failure over a large area. Therefore, more advanced bonding technology is required for mass production. For UTC-PD on SiC chip, material cost (effective use of materials) is also a demanding improvement item, because the required InP area is less than 10% of the area in the chip. OKI applied CFB technology to divide the InP-based crystal films on the InP-based epitaxial wafers at the device level, selectively picking up only the portions necessary for device operation before bonding them to the SiC wafers by heterogeneous material bonding. CFB technology, OKI's proprietary heterogeneous material bonding technology developed in the printer market and refined about 20 years of mass production, has already established high yields. The process also offers high efficiency, since InP-based crystal films divided at the device level are bonded all together at wafer-size scales. The results of evaluating the yield of devices bonded using CFB technology show dramatically higher yields in the bonding process, with the bonding yield improving from approximately 50% to nearly 100% compared to conventional processes. Additionally, dividing the crystal films at the device level and selectively bonding the devices has made it possible to make effective use of the crystal films that were previously discarded with conventional processes, helping to reduce costs and environmental impact by improving material utilization efficiency. NTT Innovative Devices developed chips by forming UTC-PDs in the device process on SiC wafers with crystal films bonded using CFB technology. The results of device evaluations following chip development showed an output power at 1dB compression exceeding 1 mW in a single device, demonstrating high output and excellent linearity. Compared to devices produced using conventional bonding processes, dark current (Note 8) was reduced to approximately one-third, confirming that the process using CFB technology is capable of bonding while effectively maintaining the characteristics of InP-based crystal films. This co-creation work has established mass production technology for high-power terahertz devices and made real-world implementation a reality. Moving forward, both companies will build on the results of this joint research to start mass production of terahertz devices in FY2026 and strengthen collaboration with industry and academia to focus on commercializing 6G communication technologies and the broad application of non-destructive sensing technologies. Both companies will also draw on the jointly developed technology to accelerate efforts to contribute to a next-generation society, communicating to the world advanced technologies for both Japanese and global markets. NTT Innovative Devices will exhibit this technology at Laser World of Photonics 2025 (Hall B2.331) to be held in Munich, Germany from June 24 to 27, 2025. [Terminology] Note 1: crystal film bonding (CFB) Acronym for crystal film bonding. OKI's proprietary heterogeneous material bonding technology involving lifting off crystal films and bonding them to substrates or wafers made of different materials. Heterogeneous material bonding is characterized by direct bonding without using adhesives. Note 2: Uni-traveling carrier photodiode (UTC-PD) The uni-traveling-carrier photodiode (UTC-PD) is a kind of pin junction photodiode that selectively uses electrons as active carriers. UTC-PD could operate faster and with much wider output linearity simply by excluding the hole transport contribution to the diode operation. Note 3: Invasiveness The degree of physical burden imposed on a patient's or subject's body during treatment or examination. Note 4: UTC-Photomixer UTC photomixer is the name of the module that applies UTC-PD to RF (THz) signal generation. 2λ laser (frequency difference: THz) are injected into the photomixer, and optical beat generate THz wave. Introduction of UTC structure allows significant THz output improvement and extension to higher frequencies. Note 5: Multilevel modulation signal A modulation method used in digital communications whereby, unlike conventional binary (0 and 1) signals, 4-, 8-, or 16-level signals are used, allowing to carry more information per modulation Note 6: Output power at 1dB compression In general, it is one of the parameters of amplifier characteristics. As the input level to the amplifier increases, the output becomes saturated and deviates from the linear relationship. The output signal level at 1 dB below the linear relationship is called the 1 dB compression point. In the same way, in an ideal photomixer, the THz output signal is proportional to the input light level, but in high light input operation, this linear relationship deviates. Note 7: NTT Innovative Devices and a Japanese university team This result was based in part on research conducted by The University of Osaka, Kyushu University, and The University of Tokyo under commission from the National Institute of Information and Communications Technology (NICT), Japan; Beyond 5G R&D Promotion Program (JPJ012368C-00901). Note 8: Dark current Small current generated by a light receiving element in the absence of light. Since this constitutes unwanted noise, a lower dark current means improved device sensitivity. About Oki Electric Industry (OKI) Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at Notes: - Oki Electric Industry Co., Ltd. is referred to as "OKI" in this document. - The names of the companies and products mentioned in this document are the trademarks or registered trademarks of the respective companies and organizations.
Malaysian Reserve
a day ago
- Business
- Malaysian Reserve
Global Antenna Market Outlook: Strategic Insights on Patch, Fractal, Smart, and Reflector Solutions
'Antennas are critical components in wireless communication, enabling signal transmission and reception across various applications. These include advanced types like patch, embedded, fractal, smart, and reflector antennas, each designed for specific performance and integration needs.' BOSTON, June 19, 2025 /PRNewswire/ — According to the latest study from BCC Research, the Antenna: Including Patch, Embedded, Fractal, Smart and Reflectors is expected to grow from $23.6 billion in 2024 to $34.4 billion by the end of 2029, at a compound annual growth rate (CAGR) of 7.8% during the forecast period of 2024 to 2029. This report presents a comprehensive examination of the global antenna market, with 2023 as the base year and forecasts from 2024 to 2029. It includes qualitative and quantitative analysis across antenna types and applications, along with regional insights for the Americas, Europe, Asia-Pacific, the Middle East and Africa. The study highlights emerging technologies, market trends, and macroeconomic factors, and profiles leading market players, their market shares, and important developments. All market values are expressed in USD $millions. The factors driving the market include: Rapid expansion of wireless communications: The rapid expansion of wireless communications is transforming how people and devices connect, enabling faster, more efficient data transfer. This growth is fueled by rising demand for mobile connectivity, IoT integration, and next-generation network technologies. Miniaturization of antennas: The miniaturization of antennas enables compact, high-performance designs suitable for modern electronic devices. This trend supports the development of smaller, smarter, and more efficient wireless communication systems. Advances in multiple-input multiple-output (MIMO) technology: Advances in MIMO technology are improving wireless communication by increasing data capacity, speed, and reliability. These innovations are essential for supporting high-performance networks like 5G and beyond. Request a Sample Copy of the Report Antenna: Including Patch, Embedded, Fractal, Smart and Reflectors Report Synopsis Report Metric Details Base year considered 2023 Forecast period considered 2024-2029 Base year market size $22.1 billion Market size forecast $34.4 billion Growth rate CAGR of 7.8% for the forecast period of 2024-2029 Segments covered Type, end use application, and region Regions covered Americas, Asia-Pacific, Europe, and Middle East and Africa Countries covered U.S., Canada, Mexico, South America, France, Germany, the U.K., Italy, Japan, India, South Korea and China Market drivers • Rapid expansion of wireless communications. • Miniaturization of antennas. • Advances in multiple-input multiple-output (MIMO) technology. Interesting facts: The rollout of 5G and ongoing development of 6G have accelerated the adoption of millimeter-wave (mmWave) technology, revolutionizing wireless communications with ultra-fast data rates. Advances in antenna technology are crucial to overcoming mmWave limitations and unlocking the full potential of next-gen networks. Smart antennas held a 30.2% market share in 2023, driven by rising demand for reliable internet and enhanced Wi-Fi performance. Their market's projected CAGR of 9.8%, indicates rapid growth due to their ability to address challenges faced by traditional antennas. Asia-Pacific led the global antenna market with over 35%, supported by R&D investments, particularly in China. The region is expected to grow at a 9.0% CAGR, with India, Japan, and South Korea advancing wireless infrastructure. The report addresses the following questions: 1. What is the market's projected size and growth rate?• The market is projected to reach $34.4 billion by 2029, growing at a CAGR of 7.8%. 2. What are the key factors driving the growth of the market?• The key factors driving the market include rapid expansion in wireless communications, and advances in MIMO technology. 3. What segments are covered in the report?• Three market segments are covered: By type, end use application and region. 4. Which type will be dominant through 2029?• The smart antenna segment is expected to dominate through the forecast period. 5. Which region has the largest market share?• Asia-Pacific holds the highest share of the global market. Leading Companies Include: • A.H. Systems, Inc.• Airgain• Amphenol Corp.• Antenna Products Corp.• ATCI• Comba Telecom Systems Holdings Ltd.• Commscope Holding Co., Inc.• First RF Corp.• Fractal Antenna Systems Inc.• Huawei Technologies Co., Ltd.• Huber+suhner• Mobi Antenna Technologies (Shenzhen) Co., Ltd.• Semtech Corp. (Formerly Sierra Wireless)• TE Connectivity• Telefonaktiebolaget LM Ericsson Related Reports Include: Global Markets for Advanced Aerospace Materials: The global market for advanced aerospace materials is driven by the demand for lightweight, high-strength, and heat-resistant components in modern aircraft and spacecraft. These materials play a vital role in enhancing fuel efficiency, performance, and sustainability in the aerospace industry. Global Satellite Internet Market: The global satellite internet market is driven by the demand for high-speed connectivity in remote and underserved regions. Valued at approximately USD $5.1 billion in 2024, the market is projected to reach USD $24.6 billion by the end of 2030, growing at a CAGR of 29.9%. Navigate Uncertainty with ConfidenceIn times of rapid change and uncertainty, having the right insights can make all the difference. At BCC Research, we are here to support innovation and help you stay ahead. Our custom research reports provide a comprehensive, 360-degree view of your market landscape, giving you the clarity you need to make informed decisions. We believe that timely, expert market intelligence should be accessible to all. That is why, for a limited time, we are offering 30% off the price of any BCC Research report to help more organizations gain access to our latest data and insights. Purchase a copy of the report directly from BCC Research. For further information on any of these reports or to make a purchase, contact info@ About BCC Research BCC Research market research reports provide objective, unbiased measurement and assessment of market opportunities. Our experienced industry analysts' goal is to help you make informed business decisions free of noise and hype. Contact Us Corporate HQ: 50 Milk St., Ste. 16, Boston, MA 02109, USAEmail: info@ +1 781-489-7301For media inquiries, email press@ or visit our media page for access to our market research data and analysis extracted from this press release must be accompanied by a statement identifying BCC Research LLC as the source and publisher.
Yahoo
a day ago
- Business
- Yahoo
Advanced Connectivity Market Report 2026-2046: Key Player Profiles Across Equipment Vendors, Satellite Operators, Service Providers, Cloud Providers, and Component Suppliers
Driven by data consumption spikes, IoT devices, and digital industry evolution, the advanced connectivity market is projected to hit hundreds of billions in revenue by 2046. It features the convergence of tech domains, with LEO constellations and optical innovations integrating with cellular infrastructure, transforming connectivity landscapes globally. Key regional players lead in different areas, such as Asia-Pacific in 5G and 6G deployment, and North America in satellite and quantum research. Advanced connectivity is pivotal in sectors like manufacturing, healthcare, automotive, and smart cities, supported by significant investments from telecommunication operators, tech vendors, and governments. As we approach 2046, the market promises transformation with the rise of artificial intelligence and quantum technologies, marking a shift towards a hyper-connected world. Dublin, June 19, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced Connectivity Market 2026-2046" report has been added to offering. The global advanced connectivity market represents one of the most dynamic and rapidly evolving technology sectors, encompassing a diverse ecosystem of wireless, optical, and emerging communication technologies that are fundamentally reshaping how societies, industries, and individuals connect and interact. This comprehensive market spans multiple interconnected technology domains including 5G and emerging 6G cellular networks, next-generation Wi-Fi standards, low-Earth orbit (LEO) satellite constellations, visible light communication (VLC), quantum networks, terahertz communications, and advanced fiber optic systems. The advanced connectivity market is experiencing unprecedented growth, driven by exponential increases in data consumption, the proliferation of Internet of Things (IoT) devices, and the digital transformation of industries worldwide. Global market revenues are projected to reach several hundred billion dollars by 2046, with compound annual growth rates varying significantly across technology segments. 5G infrastructure deployment alone represents a multi-trillion-dollar investment opportunity, while emerging technologies like 6G, quantum communications, and terahertz systems are expected to unlock entirely new market categories worth hundreds of billions in future value. A defining characteristic of this market is the convergence of previously distinct technology domains. The boundaries between terrestrial and satellite networks are blurring as LEO constellations like SpaceX's Starlink and Amazon's Project Kuiper integrate with cellular infrastructure to provide ubiquitous coverage. Similarly, optical technologies are converging with wireless systems through innovations in visible light communication and free-space optical links, creating hybrid networks that optimize performance across different environments and use cases. The advanced connectivity landscape exhibits significant regional variations in technology adoption, investment patterns, and strategic priorities. Asia-Pacific, led by China, South Korea, and Japan, dominates 5G deployment and is pioneering 6G research initiatives. North America leads in satellite constellation development and quantum communication research, while Europe focuses on regulatory harmonization and sustainable connectivity solutions. Emerging markets represent both the greatest connectivity gaps and the most significant growth opportunities, particularly for satellite-based solutions that can bypass traditional infrastructure limitations. Advanced connectivity technologies are enabling transformative applications across multiple industry verticals. In manufacturing, private 5G networks and ultra-low latency communications are enabling Industry 4.0 initiatives including autonomous robotics and real-time quality control. Healthcare is being revolutionized through telemedicine, remote surgery capabilities, and continuous patient monitoring enabled by reliable, high-speed connectivity. The automotive sector is leveraging vehicle-to-everything (V2X) communications for autonomous driving systems, while smart cities are integrating multiple connectivity technologies to optimize urban services and infrastructure. The market is characterized by massive capital expenditure requirements, with telecommunications operators, technology vendors, and governments investing hundreds of billions annually in infrastructure deployment and research and development. The competitive landscape spans traditional telecommunications equipment vendors like Ericsson, Nokia, and Huawei, emerging satellite operators such as SpaceX and OneWeb, hyperscale cloud providers including Amazon and Google, and specialized technology companies developing advanced materials, components, and systems. Looking toward 2046, the advanced connectivity market is poised for continued transformation driven by the convergence of artificial intelligence, quantum technologies, and advanced materials science. The emergence of 6G networks promises to integrate sensing, computing, and communication capabilities, while quantum networks will enable unprecedented security and computing applications. As these technologies mature and costs decline, they will enable new business models, service categories, and societal applications that are only beginning to be imagined today. This market represents not just a technology evolution but a fundamental shift toward a hyper-connected world where advanced connectivity becomes the invisible backbone enabling human progress, economic growth, and technological innovation across all sectors of society. The report provides an exhaustive analysis of the rapidly evolving telecommunications landscape, delivering critical insights into next-generation connectivity technologies that will reshape global communications infrastructure over the next two decades. This comprehensive market intelligence study examines the convergence of 5G/6G cellular networks, satellite communications, optical technologies, quantum networks, and emerging terahertz systems that collectively represent a multi-trillion-dollar market opportunity. As digital transformation accelerates across industries, advanced connectivity technologies are becoming the backbone of modern economies. The report analyzes market dynamics spanning wireless technologies including 5G-Advanced and 6G development, Wi-Fi 6/7 standards, Low-Earth Orbit (LEO) satellite constellations, visible light communication (VLC), quantum communication networks, and terahertz communications. These technologies enable applications from autonomous vehicles and smart cities to Industry 4.0 manufacturing and immersive extended reality experiences. The study provides detailed market forecasts from 2026-2046, examining technology adoption timelines, regional deployment strategies, and investment requirements. With comprehensive coverage of enabling technologies including advanced materials, antenna packaging solutions, and network infrastructure components, the report serves as an essential strategic planning resource for telecommunications operators, equipment vendors, technology investors, and government agencies. Report contents include: Market Overview: Global market size projections reaching hundreds of billions by 2046 Technology adoption timeline and maturity assessment across all connectivity segments Investment trends analysis including CapEx requirements and funding sources Key market drivers including IoT proliferation, edge computing, and industrial digitization Market challenges covering spectrum scarcity, regulatory complexity, and deployment costs Core Wireless Technologies: 5G/6G Cellular Networks: Sub-6 GHz vs mmWave deployment strategies, private network adoption, 5G-Advanced capabilities, 6G technical specifications, spectrum allocation, terahertz integration Wi-Fi 6/7 Advanced Wireless LAN: Performance comparison, enterprise vs consumer dynamics, mesh networking, cellular integration, market forecasts LEO Satellite Networks: Constellation deployment status (Starlink, Kuiper, OneWeb), direct-to-handset connectivity, ground infrastructure, regulatory challenges LPWAN Technologies: LoRaWAN, Sigfox, NB-IoT comparison, IoT application drivers, deployment economics Optical & Emerging Communication Technologies: Fiber Optic Communications: Advanced fiber technologies, FTTH deployment trends, DWDM systems, submarine cables, market forecasts Visible Light Communication (VLC) & Li-Fi: Technology fundamentals, system architecture, applications in transportation/healthcare/smart buildings, standards development Free Space Optical (FSO): Technology principles, atmospheric effects, urban connectivity applications Quantum Communication Networks: QKD fundamentals, trusted nodes, entanglement swapping, global deployment projects, SWOT analysis Terahertz Communications: Spectrum characteristics, generation/detection technologies, metamaterials, 6G applications, market forecasts Enabling Technologies & Infrastructure: Network Infrastructure: Open RAN adoption, virtualized/cloud RAN, edge computing integration, intelligent reflecting surfaces Advanced Materials: Low-loss materials for high-frequency applications, antenna packaging technologies, thermal management solutions Semiconductor Technologies: RF/mmWave chipsets, power amplifiers, GaN/SiGe/InP technologies Metamaterials & Components: Reconfigurable intelligent surfaces, zero energy devices, energy harvesting Markets & Applications Analysis: Enterprise & Industrial: Manufacturing/Industry 4.0, transportation/logistics, energy/utilities, healthcare, agriculture Consumer & Commercial: Mobile broadband, XR experiences, gaming, smart homes, emergency communications Regional Market Analysis: North America, Asia-Pacific, Europe, Rest of World deployment strategies and growth projections Competitive Landscape & Strategic Intelligence: Value chain analysis across all technology segments Market consolidation trends and competitive dynamics Key player profiles across equipment vendors, satellite operators, service providers, cloud providers, component suppliers. Notable companies in the Advanced Connectivity Market, profiled in the report, include: Ericsson Nokia Huawei Samsung Qualcomm Intel NXP Semiconductors SpaceX (Starlink) Apple NVIDIA IBM Fujitsu ID Quantique Arqit Quantum QuantumCTek Terra Quantum TeraView TeraSense Group Toptica Photonics DuPont Kyocera TDK Corporation Canon Hamamatsu Photonics AUREA Technology Alea Quantum Genesis Quantum Technology memQ For more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. CONTACT: CONTACT: Laura Wood,Senior Press Manager press@ For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900Sign in to access your portfolio
Globe and Mail
a day ago
- Business
- Globe and Mail
MWC Shanghai 2025: Tongyu Communications Showcases Innovations in Wireless Technology and Satellite Connectivity
ZHONGSHAN, China , June 19, 2025 /CNW/ -- At MWC Shanghai 2025, Tongyu Communication Inc. ( debuted MacroWiFi, a large area WiFi coverage solution, along with five key product category: satellite communication for ground-satellite connectivity, high efficiency base station antennas, Integration of Massive MIMO antennas and sheet metal filter, low-altitude coverage antenna. The product show highlighted Tongyu's advancements in field of satcom, 5G-A, 6G evolution, low-altitude economy, and last mile, offering more innovative solutions for the industry. As global digitalization has accelerated, satcom is emerging as a crucial technology for global connectivity. Tongyu presented its satellite-ground interconnection solutions, which combine Low Earth Orbit (LEO) and Geostationary Orbit (GEO) satellite technologies. This solution provided reliable and efficient connectivity for maritime shipping, aviation communication, emergency response, and remote areas. Moreover, by establishing a production base in Hubei, China , and investing in satellite businesses through joint ventures and industrial funds, the company is strategically enhancing its focus on satellite payload, ground stations and terminals for commercial applications to meet the growing demand for reliable satellite connectivity. Winnie Wu , Vice President of Tongyu Communication, stated that its solution encompasses onboard payloads, ground stations, and satellite terminals. It has been successfully used in satellite internet experimental satellites and is now part of the supply chains for major international operators. "As a key player in global communication technology innovation, Tongyu continues to make significant technological advancements, demonstrating industry-leading expertise." Pioneering technological innovation, Tongyu is continuously pushing boundaries and leading industry development. Earlier this year, the company lunched its MacroWiFi solution, which uses high-gain antennas and long-range transmission protocol to deliver WiFi coverage of 1.5 to 2 km. Pilot projects are currently ongoing in Southeast Asia . Additionally, the newly launched the antenna for low-altitude, it provides seamless coverage from ground up to 600 meters, supporting applications like drone logistics and emergency communications but also common cellular network. This innovation boosts operational efficiency and helps develop the low-altitude economy, creating new growth and collaboration opportunities across different sectors. About Tongyu Communication Tongyu Communication Inc., established in 1996, specializes in the research, development, manufacturing, and sales of mobile communication antennas, radio frequency devices, and satellite communication solutions. With production facilities in China and subsidiaries across Europe and various locations worldwide, Tongyu Communication has built a strong global presence. For more information, please visit
Associated Press
a day ago
- Business
- Associated Press
MWC Shanghai 2025: Tongyu Communications Showcases Innovations in Wireless Technology and Satellite Connectivity
ZHONGSHAN, China, June 19, 2025 /CNW/ -- At MWC Shanghai 2025, Tongyu Communication Inc. ( debuted MacroWiFi, a large area WiFi coverage solution, along with five key product category: satellite communication for ground-satellite connectivity, high efficiency base station antennas, Integration of Massive MIMO antennas and sheet metal filter, low-altitude coverage antenna. The product show highlighted Tongyu's advancements in field of satcom, 5G-A, 6G evolution, low-altitude economy, and last mile, offering more innovative solutions for the industry. As global digitalization has accelerated, satcom is emerging as a crucial technology for global connectivity. Tongyu presented its satellite-ground interconnection solutions, which combine Low Earth Orbit (LEO) and Geostationary Orbit (GEO) satellite technologies. This solution provided reliable and efficient connectivity for maritime shipping, aviation communication, emergency response, and remote areas. Moreover, by establishing a production base in Hubei, China, and investing in satellite businesses through joint ventures and industrial funds, the company is strategically enhancing its focus on satellite payload, ground stations and terminals for commercial applications to meet the growing demand for reliable satellite connectivity. Winnie Wu, Vice President of Tongyu Communication, stated that its solution encompasses onboard payloads, ground stations, and satellite terminals. It has been successfully used in satellite internet experimental satellites and is now part of the supply chains for major international operators. 'As a key player in global communication technology innovation, Tongyu continues to make significant technological advancements, demonstrating industry-leading expertise.' Pioneering technological innovation, Tongyu is continuously pushing boundaries and leading industry development. Earlier this year, the company lunched its MacroWiFi solution, which uses high-gain antennas and long-range transmission protocol to deliver WiFi coverage of 1.5 to 2 km. Pilot projects are currently ongoing in Southeast Asia. Additionally, the newly launched the antenna for low-altitude, it provides seamless coverage from ground up to 600 meters, supporting applications like drone logistics and emergency communications but also common cellular network. This innovation boosts operational efficiency and helps develop the low-altitude economy, creating new growth and collaboration opportunities across different sectors. About Tongyu Communication Tongyu Communication Inc., established in 1996, specializes in the research, development, manufacturing, and sales of mobile communication antennas, radio frequency devices, and satellite communication solutions. With production facilities in China and subsidiaries across Europe and various locations worldwide, Tongyu Communication has built a strong global presence. For more information, please visit View original content to download multimedia: SOURCE Tongyu Communication
